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參數(shù)資料
| 型號： | SMFR-29C516ESC |
| 廠商： | TEMIC SEMICONDUCTORS |
| 元件分類： | 算術邏輯單元 |
| 英文描述： | 16-BIT ERROR DETECT AND CORRECT CKT, QFP100 |
| 封裝： | MQFP-100 |
| 文件頁數(shù)： | 4/42頁 |
| 文件大?。?/td> | 809K |
| 代理商： | SMFR-29C516ESC |
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STANDARD NOTES FOR CERQUAD PACK
1/ THE CONTROLLING DIMENSION IS THE INCH.
2/ UNLESS OTHERWISE SPECIFIED, A MINIMUM CLEARANCE OF .015 INCH
(0.381 mm) SHALL BE MAINTENED BETWEEN ALL METALLIZED FEATURES
(E.G., LID, TERMINALS, THERMAL PADS, ETC..).
3/ DIMENSIONS "A" CONTROLS THE OVERALL PACKAGE HEIGHT.
4/ THIS DIMENSION ALLOWS FOR PACKAGE EDGE ANOMALIES CAUSED
BY MATERIAL
PROTUSIONS, SUCH AS ROUGH CERAMIC, MISSALIGNED
CERAMIC LAYERS AND LIDS,
MINESCUS, AND GLASS OVERRUN.
5/ THE CORNER SHAPE (SQUARE, NOTCH, RADIUS, ETC...) MAY VARY AT
THE MANUFACTURER'S OPTION, FROM THAT SHOWN ON THE DRAWING.
6/ DIMENSION "L" MEASURED BETWEEN :
* INTERSECTION OF LINE TANGENT TO REAR SIDE OF FOOT AND
PERPENDICULAR LINE TANGENT TO BOTTOM END OF FOOT
EXTREMITY.
* AND FOOT EXTREMITY .
7/ DIMENSIONS "D1/E1" DEFINE MAX. CERAMIC BODY DIMENSIONS
INCLUDING MISMATCH OF CERAMIC LAYERS.
8/ DIMENSIONS "D1/E1" INCLUDE LID TO PACKAGE MISALI GNEMENT
9/ DATUM "C" IS REFERENCED AT THE POINT OF LEAD EXIT FROM THE
PACKAGE EXTREMITY
Document number
MHS/SCC 021
Date
Issue
Page
23/12/1999
Rev C
12
Rev C
12 /42
TEMI C
Semiconductors
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