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參數(shù)資料
| 型號： | SME5434PCI-480 |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 64-BIT, 480 MHz, RISC PROCESSOR, XMA |
| 封裝： | 130 X 100 MM, 45 MM HEIGHT MODULE |
| 文件頁數(shù)： | 14/34頁 |
| 文件大?。?/td> | 418K |
| 代理商： | SME5434PCI-480 |
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21
360/440/480MHz CPU; 0.25 to 2 MB L2 cache, UPA64S, 66MHz PCI
UltraSPARC-IIi CPU Module
March 1999
Sun Microsystems, Inc
SME5431PCI-360
SME5434PCI-440
SME5434PCI-480
Preliminary
THERMAL CONSIDERATIONS
The CPU device’s operating frequency and I/O timing is affected by its junction temperature (Tj).
Airow must be directed to the CPU heatsink to keep the CPU cool. Correct airow maintains the junction
temperature within its operating range. The airow directed to the CPU is usually sufcient to keep the sur-
rounding devices on the module cool, including the SRAMs and clock circuitry.
The CPU temperature specication is provided in terms of CPU junction temperature. It is related to the case
temperature by the thermal resistance of the package and the CPU power dissipation.
The case temperature can be measured directly by a thermocouple probe to verify that the CPU junction tem-
perature is correctly maintained over the entire operating range of the system. This determination can include
factoring for load and environmental conditions. It is also possible to measure the heatsink temperature and
calculate the junction temperature. Both methods of calculating the junction temperature are presented below.
Table 1 species the terms and denitions used to calculate thermal specications for the SME5431PCI and
SME5434PCI CPU.
.
TABLE 1: Thermal Denitions
Term
Denition
Specication
Comments
Tj
Device junction temperature
See page 15
Maximum value—a lower value is preferred; verify
using one of the measuring methods
Tc
Case temperature
–
Measurable at the top-center of the device;
requires a hole in the base of the heatsink to allow
the thermocouple to contact the case
Ts
Heatsink temperature
–
Measurable as the temperature of the base of the
heatsink; The best approach is to embed a
thermocouple in a cavity drilled in the heatsink
base. An alternative is to place the thermocouple
between the ns/pins of the heatsink (insulated
from the airow) and in contact with the base plate
of the heatsink
Ti
Module inlet air temperature
–
Air temperature adjacent to the heatsink
Pd
Power dissipation of the CPU
360 MHz
17.1 W
CPU only
440 MHz
20.5 W
480 MHz
22.5 W
θjc
Junction-to-case thermal resistance of the
package
0.5
°C/W
For the UltraSPARC-II
i CPU package
θcs
Case-to-heatsink thermal resistance
0.1
°C/W
When good thermal grease contact is made
between the package and the heatsink
θsi
Heatsink-to-air thermal resistance
See page 23
Value is dependent on the heatsink design, the
airow direction, and the airow velocity; see
Airow
Free stream airow
See page 15
Airow velocity approaching the heatsink
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