參數(shù)資料
型號(hào)： SC16C554B
廠商： NXP Semiconductors N.V.
英文描述： 5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
中文描述： 5伏，3.3伏和2.5伏兆5四異步/秒（最大），16字節(jié)的FIFO
文件頁(yè)數(shù)： 49/51頁(yè)
文件大小： 253K
代理商： SC16C554B
9397 750 13133
Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 01 — 9 February 2005
49 of 51
Philips Semiconductors
SC16C554B/554DB
5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
13. Abbreviations
14. Revision history
Table 28:
Acronym
CPU
DMA
FIFO
ISDN
QUART
UART
Abbreviations
Description
Central Processing Unit
Direct Memory Access
First In/First Out
Integrated Service Digital Network
4-channel (Quad) Universal Asynchronous Receiver and Transmitter
Universal Asynchronous Receiver and Transmitter
Table 29:
Document ID
SC16C554B_554DB_1
Revision history
Release date
20050209
Data sheet status
Product data sheet
Change notice
-
Doc. number
9397 750 13133
Supersedes
-
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SC16C554B_10 制造商:PHILIPS 制造商全稱(chēng):NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V quad UART, 5 Mbit/s (max.) with 16-byte FIFOs
SC16C554BIB64 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C554BIB64,128 功能描述:UART 接口集成電路 16CB 2.5V-5V 4CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
SC16C554BIB64,128 PBF 制造商:NXP Semiconductors 功能描述:
SC16C554BIB64,151 功能描述:UART 接口集成電路 4CH. UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel
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