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參數(shù)資料
| 型號： | SC16C2552 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | Dual UART with 16-byte transmit and receive FIFOs |
| 中文描述： | 雙UART具有16字節(jié)的傳輸和接收FIFO |
| 文件頁數(shù)： | 36/38頁 |
| 文件大?。?/td> | 579K |
| 代理商： | SC16C2552 |
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Philips Semiconductors
SC16C2552
Dual UART with 16-byte transmit and receive FIFOs
Product data
Rev. 03 — 20 June 2003
36 of 38
9397 750 11636
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom
side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with
the heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[4]
[6]
[7]
13. Revision history
Table 27:
Rev Date
03
Revision history
CPCN
20030620
Description
Product data (9397 750 11636). ECN 853-2375 30034 of 16 June 2003.
Modifications:
Figure 3 “Crystal oscillator connection.” on page 9
: changed capacitors’ values and
added connection with oscillator.
Product data (9397 750 11205). ECN 853-2375 29620 of 07 March 2003.
Product data (9397 750 08936). ECN 853-2375 28891 of 10 September 2002.
-
02
01
20030313
20020910
-
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| SC16C2552B | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:5 V, 3.3 V and 2.5 V dual UART, 5 Mbit/s (max.), with 16-byte FIFOs |
| SC16C2552BIA44 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C2552BIA44,512 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C2552BIA44,518 | 功能描述:UART 接口集成電路 16CB 2.5V-5V 2CH RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
| SC16C2552BIA44,529 | 功能描述:UART 接口集成電路 2CH. UART 16B FIFO RoHS:否 制造商:Texas Instruments 通道數(shù)量:2 數(shù)據(jù)速率:3 Mbps 電源電壓-最大:3.6 V 電源電壓-最小:2.7 V 電源電流:20 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 封裝 / 箱體:LQFP-48 封裝:Reel |
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