參數(shù)資料
型號: SAL-XC886C-6FFA5V
廠商: INFINEON TECHNOLOGIES AG
元件分類: 微控制器/微處理器
英文描述: 8-BIT, FLASH, 80 MHz, MICROCONTROLLER, PQFP48
封裝: GREEN, PLASTIC, TQFP-48
文件頁數(shù): 37/134頁
文件大?。?/td> 864K
代理商: SAL-XC886C-6FFA5V
SAL-XC886CLM
Package and Quality Declaration
Data Sheet
124
V1.0, 2010-05
5
Package and Quality Declaration
Chapter 5 provides the information of the SAL-XC886 package and reliability section.
5.1
Package Parameters
Table 50 provides the thermal characteristics of the package used in SAL-XC886.
Table 50
Thermal Characteristics of the Packages
Parameter
Symbol
Limit Values
Unit
Notes
Min.
Max.
PG-TQFP-48
Thermal resistance junction
case
R
TJC
CC -
11.6
K/W
1)2)
1) The thermal resistances between the case and the ambient (
R
TCA) , the lead and the ambient (RTLA) are to be
combined with the thermal resistances between the junction and the case (
R
TJC), the junction and the lead
(
R
TJL) given above, in order to calculate the total thermal resistance between the junction and the ambient
(
R
TJA). The thermal resistances between the case and the ambient (RTCA), the lead and the ambient (RTLA)
depend on the external system (PCB, case) characteristics, and are under user responsibility.
The junction temperature can be calculated using the following equation:
T
J=TA+RTJA × PD, where the RTJA is
the total thermal resistance between the junction and the ambient. This total junction ambient resistance
R
TJA
can be obtained from the upper four partial thermal resistances, by
a) simply adding only the two thermal resistances (junction lead and lead ambient), or
b) by taking all four resistances into account, depending on the precision needed.
2) Not all parameters are 100% tested, but are verified by design/characterization and test correlation.
Thermal resistance junction
lead
R
TJL
CC -
33.2
K/W
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