參數(shù)資料
型號(hào)： SAH-XC2723X-20F66V
廠商： INFINEON TECHNOLOGIES AG
元件分類： 微控制器/微處理器
英文描述： 32-BIT, FLASH, 66 MHz, RISC MICROCONTROLLER, PQCC48
封裝： 0.50 MM PITCH, GREEN, PLASTIC, VQFN-48
文件頁(yè)數(shù)： 10/112頁(yè)
文件大?。?/td> 3116K
代理商： SAH-XC2723X-20F66V
XC2723X
XC2000 Family / Econo Line
Package and Reliability
PRELIMINARY
Data Sheet
103
V1.0, 2010-12
5
Package and Reliability
The XC2000 Family devices use the package type:
PG-VQFN (Plastic Green - Very Thin Profile Quad Flat Non-Leaded Package)
The following specifications must be regarded to ensure proper integration of the
XC2723X in its target environment.
5.1
Packaging
These parameters specify the packaging rather than the silicon.
Note: To improve the EMC behavior, it is recommended to connect the exposed pad to
the board ground, independent of the thermal requirements.
Board layout examples are given in an application note.
Package Compatibility Considerations
The XC2723X is a member of the XC2000 Family of microcontrollers. It is also
compatible to a certain extent with members of similar families or subfamilies.
Each package is optimized for the device it houses. Therefore, there may be slight
Table 38
Package Parameters (PG-VQFN-48-54)
Parameter
Symbol
Limit Values
Unit Notes
Min.
Max.
Exposed Pad Dimension
Ex
× Ey –
5.2 x 5.2
mm –
Power Dissipation
P
DISS
–0.7
W
–
Thermal resistance
Junction-Ambient
RΘJA
–
73
K/W No thermal via,
2-layer1)
1) Device mounted on a 2-layer JEDEC board (according to JESD 51-3) without thermal vias; exposed pad not
soldered.
49
K/W No thermal via,
4-layer2)
2) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) without thermal vias; exposed pad not
soldered.
43
K/W 4-layer, no pad3)
3) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad not
soldered.
34
K/W 4-layer, pad4)
4) Device mounted on a 4-layer JEDEC board (according to JESD 51-7) with thermal vias; exposed pad soldered
to the board.
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