參數(shù)資料
型號： SAA7324
廠商： NXP Semiconductors N.V.
英文描述： Digital servo processor and Compact Disc decoder with integrated DAC (CD10 II)(具有綜合數(shù)模轉(zhuǎn)換器（DAC）的數(shù)字伺服處理器和光盤譯碼器)
中文描述： 數(shù)字伺服處理器和光盤解碼器集成了援會（CD10型二）（具有綜合數(shù)模轉(zhuǎn)換器（DAC）的的數(shù)字伺服處理器和光盤譯碼器）
文件頁數(shù)： 65/68頁
文件大?。?/td> 285K
代理商： SAA7324
2000 Jun 26
65
Philips Semiconductors
Product specification
Digital servo processor and Compact Disc
decoder with integrated DAC (CD10 II)
SAA7324
15.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(3)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(2)
suitable
not recommended
(3)(4)
not recommended
(5)
suitable
suitable
suitable
suitable
suitable
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA7324H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital servo processor and Compact Disc decoder with integrated DAC CD10 II
SAA7324H/M2B,557 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 COMPACT DISC SYSTEMS RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
SAA7324HBG 功能描述:編碼器、解碼器、復(fù)用器和解復(fù)用器 COMPACT DISC SYSTEMS RoHS:否 制造商:Micrel 產(chǎn)品:Multiplexers 邏輯系列:CMOS 位數(shù): 線路數(shù)量（輸入/輸出）:2 / 12 傳播延遲時(shí)間:350 ps, 400 ps 電源電壓-最大:2.625 V, 3.6 V 電源電壓-最小:2.375 V, 3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-44 封裝:Tray
SAA7325 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital servo processor and Compact Disc decoder with integrated DAC CD10
SAA7325H 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital servo processor and Compact Disc decoder with integrated DAC CD10
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