參數(shù)資料
型號(hào)： SAA7120H
廠商： NXP SEMICONDUCTORS
元件分類： 顏色信號(hào)轉(zhuǎn)換
英文描述： Digital video encoder
中文描述： COLOR SIGNAL ENCODER, PQFP44
封裝： 10 X 10 MM, 1.75 MM HEIGHT, PLASTIC, SOT-307-2, QFP-44
文件頁(yè)數(shù)： 33/36頁(yè)
文件大?。?/td> 165K
代理商： SAA7120H
2002 Oct 11
33
Philips Semiconductors
Product specification
Digital video encoder
SAA7120H; SAA7121H
11.5
Suitability of surface mount IC packages for wave and reflow soldering methods
Notes
1.
For more detailed information on the BGA packages refer to the“(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
PACKAGE
(1)
SOLDERING METHOD
WAVE
REFLOW
(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN,
HVSON, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
not suitable
not suitable
(3)
suitable
suitable
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
suitable
suitable
相關(guān)PDF資料
PDF描述
SAA7152 Digital Video Comb Filter DCF
SAA7184 Digital Video Encoders DENC2-M6
SAA7187 Digital video encoder (DENC2-SQ)(數(shù)字視頻編碼器)
SAA7188A Digital Video Encoder (DENC2-M)(數(shù)字視頻編碼器(DENC2-M))
SAA7201 Integrated MPEG2 AVG Decoder(綜合MPEG音頻視頻圖表譯碼器)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
SAA7120H-01 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Video Encoder (ConDENC)
SAA7121 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:Digital Video Encoder (ConDENC)
SAA7121H 制造商:NXP Semiconductors 功能描述:
SAA7121H/V2 制造商:NXP Semiconductors 功能描述:
SAA7121H/V2,518 功能描述:視頻 IC SAA7121H/QFP44/REEL13DP//V2 RoHS:否 制造商:Fairchild Semiconductor 工作電源電壓:5 V 電源電流:80 mA 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-28 封裝:Reel
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