參數(shù)資料
型號(hào)： RC28F160C3TC90
廠(chǎng)商： INTEL CORP
元件分類(lèi)： PROM
英文描述： 1M X 16 FLASH 3V PROM, 90 ns, PBGA64
封裝： BGA-64
文件頁(yè)數(shù)： 59/72頁(yè)
文件大?。?/td> 1083K
代理商： RC28F160C3TC90
Intel Advanced+ Boot Block Flash Memory (C3)
May 2005
Intel Advanced+ Boot Block Flash Memory (C3)
Datasheet
62
Order Number: 290645, Revision: 023
Appendix C Common Flash Interface
This appendix defines the data structure or “database” returned by the Common Flash Interface
(CFI) Query command. System software should parse this structure to gain critical information
such as block size, density, x8/x16, and electrical specifications. Once this information has been
obtained, the software detects which command sets to use to enable flash writes, block erases, and
otherwise control the flash component. The Query is part of an overall specification for multiple
command set and control interface descriptions called Common Flash Interface, or CFI.
C.1
Query Structure Output
The Query database allows system software to obtain information for controlling the flash device.
This section describes the device’s CFI-compliant interface that allows access to Query data.
Query data are presented on the lowest-order data outputs (DQ0-DQ7) only. The numerical offset
value is the address relative to the maximum bus width supported by the device. On this family of
devices, the Query table device starting address is a 0x10, which is a word address for x16 devices.
For a word-wide (x16) device, the first two Query-structure bytes, ASCII “Q” and “R,” appear on
the low byte at word addresses 0x10 and 0x11. This CFI-compliant device outputs 0x00 data on
upper bytes. The device outputs ASCII “Q” in the low byte (DQ0-DQ7) and 0x00 in the high byte
(DQ8-DQ15).
At Query addresses containing two or more bytes of information, the least-significant data byte is
presented at the lower address, and the most-significant data byte is presented at the higher address.
For tables in this appendix, addresses and data are represented in hexadecimal notation, so the “h”
suffix has been dropped. In addition, since the upper byte of word-wide devices is always “0x00,”
the leading “00” has been dropped from the table notation and only the lower byte value is shown.
Any x16 device outputs can be assumed to have 0x00 on the upper byte in this mode.
Table 27.
Summary of Query Structure Output as a Function of Device and Mode
Device
Hex Offset
Hex Code
ASCII Value
Device Addresses
00010:
51
"Q"
00011:
52
"R"
00012:
59
"Y"
相關(guān)PDF資料
PDF描述
RC28F160C3BD70 1M X 16 FLASH 3V PROM, 70 ns, PBGA64
RC4194K DUAL OUTPUT, ADJUSTABLE MIXED REGULATOR, MBFM9
RM4194K DUAL OUTPUT, ADJUSTABLE MIXED REGULATOR, MBFM9
RC4194D DUAL OUTPUT, ADJUSTABLE MIXED REGULATOR, CDIP14
RM4194D/883B DUAL OUTPUT, ADJUSTABLE MIXED REGULATOR, CDIP14
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
RC28F160C3TD70 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:Advanced+ Boot Block Flash Memory (C3)
RC28F160C3TD70A 功能描述:IC FLASH 16MBIT 70NS 64BGA RoHS:否 類(lèi)別:集成電路 (IC) >> 存儲(chǔ)器 系列:- 標(biāo)準(zhǔn)包裝:96 系列:- 格式 - 存儲(chǔ)器:閃存 存儲(chǔ)器類(lèi)型:FLASH 存儲(chǔ)容量:16M（2M x 8，1M x 16） 速度:70ns 接口:并聯(lián) 電源電壓:2.65 V ~ 3.6 V 工作溫度:-40°C ~ 85°C 封裝/外殼:48-TFSOP（0.724"，18.40mm 寬） 供應(yīng)商設(shè)備封裝:48-TSOP 包裝:托盤(pán)
RC28F160C3TD70B 制造商:Micron Technology Inc 功能描述:16MB, ARMAGOSA EBGA 3.0
RC28F256J3A-110 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
RC28F256J3A-115 制造商:INTEL 制造商全稱(chēng):Intel Corporation 功能描述:Intel StrataFlash Memory (J3)
發(fā)布緊急采購(gòu)，3分鐘左右您將得到回復(fù)。

采購(gòu)需求

(若只采購(gòu)一條型號(hào)，填寫(xiě)一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購(gòu)。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠(chǎng)商 批號(hào) 封裝
添加更多采購(gòu)

我的聯(lián)系方式

*
*
*