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參數(shù)資料
| 型號(hào)： | PNX8526EH |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類： | 消費(fèi)家電 |
| 英文描述： | Programmable source decoder with integrated peripherals |
| 中文描述： | SPECIALTY CONSUMER CIRCUIT, PBGA456 |
| 封裝： | 35 X 35 MM, 1.8 MM HEIGHT, PLASTIC, MS-034, SOT610-1, HBGA-456 |
| 文件頁數(shù)： | 57/59頁 |
| 文件大?。?/td> | 3319K |
| 代理商： | PNX8526EH |
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Philips Semiconductors
PNX8526
Programmable Source Decoder with Integrated Peripherals
Preliminary data
Rev. 01 – 6 October 2003
57 of 59
9397 750 11715
Koninklijke Philips Electronics N.V. 2003. All rights reserved.
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must
on no account be processed through more than one soldering cycle or subjected to infrared reflow
soldering with peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow
oven. The package body peak temperature must be kept as low as possible.
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side,
the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the
heatsink on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it
is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Hot bar or manual soldering is suitable for PMFP packages.
[4]
[5]
[6]
[7]
[8]
18. Revision history
Table 40:
Rev Date
01 20031006
Revision history
CPCN
Description
Preliminary data (9397 750 11715)
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