
Ericsson Internal
PROD. SPEC. MECH.
3 (6)
Prepared (also subject responsible if other)
No.
EPANHON
5/1301-BMR 657 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Julia You)
See §1
2007-06-25
B
Soldering Information – Through Hole Mounting
The through hole mount version of the product is intended
for manual or wave soldering. When wave soldering is used,
the temperature on the pins is specified to maximum 270 °C
for maximum 10 seconds.
A maximum preheat rate of 4°C/s and a temperature of max
of +150°C is suggested. When soldering by hand, care
should be taken to avoid direct contact between the hot
soldering iron tip and the pins for more than a few seconds
in order to prevent overheating.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Delivery Package Information
The TH version products are delivered in antistatic trays.
The SMD version products are delivered in antistatic trays
and antistatic carrier tape (EIA 481 standard).
Tray Specifications
Material
Antistatic PET
Surface resistance
106 < Ohm/square < 1012
Tray capacity
42 products/tray
Tray thickness
13 mm [0.512 inch]
Box capacity
210 products ( 5 full trays/box)
Bakability
The tray is not bakable.
Carrier Tape Specifications
Material
Antistatic PS
Surface resistance
107 < Ohm/square < 1012
Bakability
The tape is not bakable.
Tape width
44 mm [1.732 inch]
Pocket pitch
32 mm [1.260 inch]
Pocket depth
9.09 mm [0.358 inch]
Reel diameter
381 mm [15 inch]
Reel capacity
200 products /reel
Non-Dry Pack Information
The through hole mount version of product is delivered in
non-dry packing trays.
The lead (Pb) surface mount version of product is delivered
in non-dry packing trays or tape & reel.
Dry Pack Information
The lead free (Pb-free) surface mount version of the product
is delivered in trays or tape & reel. These inner shipment
containers are dry packed in standard moisture barrier bags
according to IPC/JEDEC standard J-STD-033 (Handling,
packing, shipping and use of moisture/reflow sensitivity
surface mount devices).
Using products in high temperature Pb-free soldering
processes requires dry pack storage and handling. In case
the products have been stored in an uncontrolled
environment and no longer can be considered dry, the
odules must be baked according to J-STD-033.
m
E
PMP 5000 series
PoL Regulator
Input 4.5 - 14 V, Output up to 16 A / 88 W
EN/LZT 146 388 R1B December 2009
Ericsson AB
Technical Specication
58