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參數(shù)資料
| 型號： | PMP5818UWSR |
| 廠商： | ERICSSON POWER MODULES AB |
| 元件分類： | 電源模塊 |
| 英文描述： | 1-OUTPUT 88 W DC-DC REG PWR SUPPLY MODULE |
| 封裝： | ROHS COMPLIANT PACKAGE-11 |
| 文件頁數(shù)： | 52/60頁 |
| 文件大?。?/td> | 4072K |
| 代理商： | PMP5818UWSR |
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Ericsson Internal
PROD. SPEC. MECH.
1 (6)
Prepared (also subject responsible if other)
No.
EPANHON
5/1301-BMR 657 Uen
Approved
Checked
Date
Rev
Reference
SEC/D (Julia You)
See §1
2007-06-25
B
Soldering Information - Surface Mounting
The surface mount version of the product is intended for
convection or vapor phase reflow SnPb or Pb-free
processes. To achieve a good and reliable soldering result,
make sure to follow the recommendations from the solder
paste supplier, to use state-of-the-art reflow equipment and
reflow profiling techniques as well as the following
guidelines.
A no-clean flux is recommended to avoid entrapment of
cleaning fluids in cavities inside the product or between the
product and the host board. The cleaning residues may
affect long time reliability and isolation voltage.
Minimum Pin Temperature Recommendations
Pin number 8 is chosen as reference location for the
minimum pin temperature recommendations since this will
likely be the coolest solder joint during the reflow process.
Pin 8 for measurement of minimum
solder joint temperature, T
PIN
Pin 1 for measurement of maximum
peak product reflow temperature, T
P
SnPb solder processes
For SnPb solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature, (TL, +183°C for
Sn63/Pb37) for more than 30 seconds, and a peak
temperature of +210°C is recommended to ensure a reliable
solder joint.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in
excess of the solder melting temperature (TL, +217 to
+221°C for Sn/Ag/Cu solder alloys) for more than 30
seconds, and a peak temperature of +235°C on all solder
joints is recommended to ensure a reliable solder joint.
Peak Product Temperature Requirements
Pin 1 is chosen as reference location for the maximum
(peak) allowed product temperature (TP) since this will likely
be the warmest part of the product during the reflow
process.
To avoid damage or performance degradation of the
product, the reflow profile should be optimized to avoid
excessive heating. A sufficiently extended preheat time is
recommended to ensure an even temperature across the
host PCB, for both small and large devices. To reduce the
risk of excessive heating is also recommended to reduce the
time in the reflow zone as much as possible.
SnPb solder processes
For SnPb solder processes, the product is qualified for MSL
1 according to IPC/JEDEC standard J-STD-020C.
During reflow, TP must not exceed +225°C at any time.
Lead-free (Pb-free) solder processes
For Pb-free solder processes, the product is qualified for
MSL 3 according to IPC/JEDEC standard J-STD-020C.
During reflow, TP must not exceed +260°C at any time.
E
PMP 5000 series
PoL Regulator
Input 4.5 - 14 V, Output up to 16 A / 88 W
EN/LZT 146 388 R1B December 2009
Ericsson AB
Technical Specication
56
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