參數(shù)資料
型號(hào): PCX7447AVGH1167NB
廠商: Atmel
文件頁(yè)數(shù): 6/52頁(yè)
文件大小: 0K
描述: IC MPU 32BIT 1167MHZ 360CBGA
標(biāo)準(zhǔn)包裝: 44
處理器類型: PowerPC 32-位 RISC
速度: 1.167GHZ
電壓: 1.1V
安裝類型: 表面貼裝
封裝/外殼: 360-CBBGA 裸露焊盤(pán)
供應(yīng)商設(shè)備封裝: 360-CBGA(25x25)
包裝: 托盤(pán)
14
0833E–HIREL–01/07
PC7447A
e2v semiconductors SAS 2007
Figure 6-4.
Thermal Performance of Select Thermal Interface Material
6.4.4.1
Heat Sink Selection Example
For preliminary heat sink sizing, the die-junction temperature can be expressed as follows:
T
J = TI + Tr + (R
θJC + Rθint + Rθsa) × Pd
where:
T
J is the die-junction temperature
T
i is the inlet cabinet ambient temperature
T
r is the air temperature rise within the computer cabinet
RθJC is the junction-to-case thermal resistance
Rθint is the adhesive or interface material thermal resistance
Rθsa is the heat sink base-to-ambient thermal resistance
P
d is the power dissipated by the device
During operation, the die-junction temperatures (T
J) should be maintained less than the value specified
in Table 6-2 on page 10. The temperature of air cooling the component greatly depends on the ambient
inlet air temperature and the air temperature rise within the electronic cabinet. An electronic cabinet inlet-
air temperature (T
i) may range from 30° to 40°C. The air temperature rise within a cabinet (Tr) may be in
the range of 5° to 10°C. The thermal resistance of the thermal interface material (Rθint) is typically about
1.5°C/W. For example, assuming a T
i of 30°C, a Tr of 5°C, an HITCE package R
θJC = 0.1, and a typical
power consumption (P
d) of 18.7W, the following expression for TJ is obtained:
Die-junction temperature: T
J = 30°C + 5°C + (0.1°C/W + 1.5°C/W + θsa) × 18.7W
0
0.5
1
1.5
2
010
20
30
40
50
60
70
80
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
Contact Pressure (psi)
Specific
Ther
mal
Resistance
(K-in.
2
/W)
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