參數(shù)資料
型號(hào)： PCX7447AVGH1167NB
廠商： Atmel
文件頁(yè)數(shù)： 5/52頁(yè)
文件大?。?/td> 0K
描述： IC MPU 32BIT 1167MHZ 360CBGA
標(biāo)準(zhǔn)包裝： 44
處理器類型： PowerPC 32-位 RISC
速度： 1.167GHZ
電壓： 1.1V
安裝類型： 表面貼裝
封裝/外殼： 360-CBBGA 裸露焊盤
供應(yīng)商設(shè)備封裝： 360-CBGA（25x25）
包裝： 托盤
13
0833E–HIREL–01/07
e2v semiconductors SAS 2007
PC7447A
Figure 6-3.
Package Exploded Cross-sectional View with Several Heat Sink Options
6.4.4
Thermal Interface Materials
A thermal interface material is recommended at the package lid-to-heat sink interface to minimize the
thermal contact resistance. For those applications where the heat sink is attached by spring clip mecha-
nism, Figure 6-4 on page 14 shows the thermal performance of three thin-sheet thermal-interface
materials (silicone, graphite/oil, floroether oil), a bare joint, and a joint with thermal grease as a function
of contact pressure.
As shown, the performance of these thermal interface materials improves with increasing contact
pressure.
The use of thermal grease significantly reduces the interface thermal resistance. That is, the bare joint
results in a thermal resistance approximately seven times greater than the thermal grease joint.
Often, heat sinks are attached to the package by means of a spring clip to holes in the printed-circuit
board (see Figure 6-3 on page 13). Therefore, synthetic grease offers the best thermal performance,
considering the low interface pressure, and is recommended due to the high power dissipation of the
PC7447A. Of course, the selection of any thermal interface material depends on many factors – thermal
performance requirements, manufacturability, service temperature, dielectric properties, cost, and so on.
Printed-Circuit Board
Thermal Interface
Material
Heat Sink
Clip
Heat Sink
HCTE Package
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