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參數(shù)資料
| 型號： | PCF8570 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 256 x 8-bit static low-voltage RAM with I2C-bus interface |
| 中文描述： | 256 × 8位靜態(tài)低電壓內(nèi)存具有I2C總線接口 |
| 文件頁數(shù)： | 17/20頁 |
| 文件大小： | 140K |
| 代理商： | PCF8570 |
1999 Jan 06
17
Philips Semiconductors
Product specification
256
×
8-bit static low-voltage RAM with
I
2
C-bus interface
PCF8570
15.4
Suitability of IC packages for wave, reflow and dipping soldering methods
Notes
1.
All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is only suitable for LQFP, QFP and TQFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2.
3.
4.
5.
6.
MOUNTING
PACKAGE
SOLDERING METHOD
WAVE
REFLOW
(1)
suitable
suitable
suitable
suitable
suitable
DIPPING
Through-hole mount DBS, DIP, HDIP, SDIP, SIL
Surface mount
BGA, SQFP
HLQFP, HSQFP, HSOP, HTSSOP, SMS
PLCC
(4)
, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
(2)
not suitable
not suitable
(3)
suitable
not recommended
(4)(5)
not recommended
(6)
suitable
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| PCF8576C | Universal LCD driver for low multiplex rates |
| PCF8576CH | Universal LCD driver for low multiplex rates |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| PCF8570P | 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:256 x 8-bit static low-voltage RAM with I2C-bus interface |
| PCF8570P/F5 | 制造商:NXP Semiconductors 功能描述:3400ns Bulk 制造商:NXP Semiconductors 功能描述:IC SRAM CMOS 2K 8570 DIP8 |
| PCF8570P/F5,112 | 功能描述:靜態(tài)隨機存取存儲器 RAM 256X8 W/I2C LOW PWR -40+85 RoHS:否 制造商:Cypress Semiconductor 存儲容量:16 Mbit 組織:1 M x 16 訪問時間:55 ns 電源電壓-最大:3.6 V 電源電壓-最小:2.2 V 最大工作電流:22 uA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風格:SMD/SMT 封裝 / 箱體:TSOP-48 封裝:Tray |
| PCF8570P/F5 | 制造商:NXP Semiconductors 功能描述:IC SRAM CMOS 2K 8570 DIP8 |
| PCF8570P/F5112 | 制造商:NXP Semiconductors 功能描述:IC SRAM 1KBIT I2C DIP-8 制造商:NXP Semiconductors 功能描述:IC SRAM 2K 8570 DIP8 |
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