參數(shù)資料
型號(hào): PC56F8006VWL
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 47/106頁(yè)
文件大?。?/td> 0K
描述: DSP 16BIT 28-SOIC
標(biāo)準(zhǔn)包裝: 26
系列: 56F8xxx
核心處理器: 56800
芯體尺寸: 16-位
速度: 32MHz
連通性: I²C,LIN,SCI,SPI
外圍設(shè)備: LVD,POR,PWM,WDT
輸入/輸出數(shù): 23
程序存儲(chǔ)器容量: 16KB(8K x 16)
程序存儲(chǔ)器類型: 閃存
RAM 容量: 1K x 16
電壓 - 電源 (Vcc/Vdd): 1.8 V ~ 3.6 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 15x12b
振蕩器型: 內(nèi)部
工作溫度: -40°C ~ 105°C
封裝/外殼: 28-SOIC(0.295",7.50mm 寬)
包裝: 管件
Specifications
MC56F8006/MC56F8002 Digital Signal Controller, Rev. 4
Freescale Semiconductor
45
NOTE
Junction-to-ambient thermal resistance determined per JEDEC JESD51–3 and JESD51–6.
Thermal test board meets JEDEC specification for this package.
Junction-to-board thermal resistance determined per JEDEC JESD51–8. Thermal test
board meets JEDEC specification for the specified package.
Junction-to-case at the top of the package determined using MIL-STD 883 Method 1012.1.
The cold plate temperature is used for the case temperature. Reported value includes the
thermal resistance of the interface layer.
Thermal characterization parameter indicating the temperature difference between the
package top and the junction temperature per JEDEC JESD51–2. When Greek letters are
not available, the thermal characterization parameter is written as Psi-JT
Junction temperature is a function of die size, on-chip power dissipation, package thermal
resistance, mounting site (board) temperature, ambient temperature, air flow, power
dissipation of other components on the board, and board thermal resistance.
See Section 9.1, “Thermal Design Considerations,” for more detail on thermal design
considerations.
8.4
Recommended Operating Conditions
This section includes information about recommended operating conditions.
Table 18. 48LQFP Package Thermal Characteristics
Characteristic
Comments
Symbol
Value
(LQFP)
Unit
Junction to ambient
Natural convection
Single layer board
(1s)
RJA
79
°C/W
Junction to ambient
Natural convection
Four layer board
(2s2p)
RJMA
55
°C/W
Junction to ambient
(@200 ft/min)
Single layer board
(1s)
RJMA
66
°C/W
Junction to ambient
(@200 ft/min)
Four layer board
(2s2p)
RJMA
48
°C/W
Junction to board
RJB
34
°C/W
Junction to case
RJC
20
°C/W
Junction to package top
Natural Convection
JT
4°C/W
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