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參數(shù)資料
| 型號(hào)： | PBRP123YT,215 |
| 廠商： | NXP SEMICONDUCTORS |
| 元件分類(lèi)： | 小信號(hào)晶體管 |
| 英文描述： | PNP 800 mA, 40 V BISS RET; R1 = 2.2 kOhm, R2 = 10 kOhm; Package: SOT23 (TO-236AB); Container: Tape reel smd |
| 中文描述： | 600 mA, 40 V, PNP, Si, SMALL SIGNAL TRANSISTOR, TO-236AB |
| 封裝： | PLASTIC, SMD, 3 PIN |
| 文件頁(yè)數(shù)： | 12/12頁(yè) |
| 文件大?。?/td> | 114K |
| 代理商： | PBRP123YT,215 |
PBRP123YT_1
NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 01 — 17 December 2007
9 of 12
NXP Semiconductors
PBRP123YT
PNP 800 mA, 40 V BISS RET; R1 = 2.2 k
, R2 = 10 k
9.
Packing information
[1]
For further information and the availability of packing methods, see Section 13.
10. Soldering
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
10000
PBRP123YT
SOT23
4 mm pitch, 8 mm tape and reel
-215
-235
Fig 12. Reow soldering footprint SOT23 (TO-236AB)
Fig 13. Wave soldering footprint SOT23 (TO-236AB)
solder resist
occupied area
solder lands
solder paste
Dimensions in mm
sot023
1.00
0.60
(3x)
1.30
1
2
3
2.50
3.00
0.85
2.70
2.90
0.50 (3x)
0.60 (3x)
3.30
0.85
sot023
4.00
4.60
2.80
4.50
1.20
3.40
3
21
1.20 (2x)
preferred transport direction during soldering
Dimensions in mm
solder resist
occupied area
solder lands
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