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參數(shù)資料
| 型號： | NIS3001QPT1 |
| 廠商： | ON SEMICONDUCTOR |
| 元件分類： | 穩(wěn)壓器 |
| 英文描述： | Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
| 中文描述： | 4 A SWITCHING REGULATOR, 1000 kHz SWITCHING FREQ-MAX, BCC21 |
| 封裝： | QFN-21 |
| 文件頁數(shù)： | 13/18頁 |
| 文件大?。?/td> | 208K |
| 代理商： | NIS3001QPT1 |
NIS3001
http://onsemi.com
13
APPLICATION INFORMATION
INTRODUCTION
Various ON Semiconductor components are packaged in
an advanced Quad Flatpack NoLead Package (QFN) or
commonly referred to as a Leadless Package. Because the
QFN(Leadless) platform represent the latest in surface
mount packaging technology, it is important that the design
of the Printed Circuit Board (PCB), as well as the assembly
process, follow the suggested guidelines outlined in this
document.
NIS3001 Package Overview
The QFN platform offers a versatility, which allows
either a single or multiple semiconductor devices to be
connected together within a leadless package.
In this case the NIS3001 Package contains multiple
semiconductor devices within one package. This package
style was chosen due to its excellent thermal dissipation
and reduced electrical parasitics.
When surface mounting this package onto a PCB, two
critical issues must be considered:
1. Printed Circuit Board Design
2. Board Mounting Process.
This document will address both of these critical issues.
Printed Circuit Board Design Considerations
SMD and NSMD pad configurations
There are two different types of PCB pad configurations
commonly used for surface mount leadless QFN style
packages. These different I/O configurations are:
1. Non Solder masked Defined (NSMD)
2. Solder Masked Defined (SMD)
As their titles describe, the NSMD contact pads have the
solder mask pulled away from the solderable metallization,
while the SMD pads have the solder mask over the edge of
the metallization, as shown in Figure 17. With the SMD
Pads, the solder mask restricts the flow of solder paste on
the top of the metallization which prevents the solder from
flowing along the side of the metal pad. This is different
from the NSMD configuration where the solder will flow
around both the top and the sides of the metallization.
Figure 17. Comparison of NSMD versus SMD
pads.
NSMD
SMD
Solder Mask
Opening
Solder Mask
Overlay
Solderable
Pad
Typically, the NSMD pads are preferred over the SMD
configuration since defining the location and size of the
copper pad is easier to control than the solder mask. This
is based on the fact that the copper etching process is
capable of a tighter tolerance than the solder masking
process.
In addition, the SMD pads will inherently create a stress
concentration point where the solder wets to the pad on top
of the lead. This stress concentration point is eliminated
when the solder is allowed to flow down the sides of the
leads in the NSMD configuration.
NSMD Pad Configurations
When dimensionally possible, the solder mask should be
located at least a
±
0.076mm (0.003in) away from the edge
of the solderable pad. This spacing is used to compensate
for the registration tolerances of the solder mask, as well as
to insure that the solder is not inhibited by the mask as it
reflows along the sides of the metal pad. The dimensions
of the soldermask openings are shown in Figure 18 for a
preferred nonsoldermask configuration.
The dimensions of the PCB’s solderable pads should
match those of the pads on the package as shown in
Figure 19. The 1:1 ratio between the package’s pad
configuration, and that of the PCB’s, is desired for optimal
placement accuracy and reliability. Please note that
NIS3001 Footprint shows smaller exposed pad openings
compared with the recommended PCB layout. Die attach
pads on the footprint were divided into smaller exposed
pads to help reduce the risk of solder voiding during reflow
mounting to the package
Figure 18. NSMD Openings for PCB Layout
0.941
12X
4.720
0.508
3.810
1.765
1.765
6.745
6.274
9.992
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| NIS3001 | Integrated Driver and MOSFET Power Chip for Synchronous Buck Controllers |
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相關(guān)代理商/技術(shù)參數(shù) |
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| NIS5101 | 制造商:ONSEMI 制造商全稱:ON Semiconductor 功能描述:SMART HotPlug IC/Inrush Limiter/Circuit Breaker |
| NIS5101-D | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Smart Hot Plug?IC/Inrush Limiter/Circuit Breaker |
| NIS5101E1T1 | 功能描述:熱插拔功率分布 SMART HotSwap RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| NIS5101E1T1G | 功能描述:熱插拔功率分布 -48V Hotswap RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
| NIS5101E2T1 | 功能描述:熱插拔功率分布 SMART HotSwap RoHS:否 制造商:Texas Instruments 產(chǎn)品:Controllers & Switches 電流限制: 電源電壓-最大:7 V 電源電壓-最小:- 0.3 V 工作溫度范圍: 功率耗散: 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Tube |
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