參數(shù)資料
型號: NCV8881PWR2G
廠商: ON Semiconductor
文件頁數(shù): 3/33頁
文件大?。?/td> 321K
描述: IC REG TRPL BUCK/LINEAR 16SOIC
標(biāo)準(zhǔn)包裝: 1
拓?fù)洌?/td> 降壓(降壓)(1),線性(LDO)(2)
功能: 車載
輸出數(shù): 3
頻率 - 開關(guān): 170kHz
電壓/電流 - 輸出 1: 3.3 V ~ 8 V,1.5A
電壓/電流 - 輸出 2: 5V,100mA
電壓/電流 - 輸出 3: 8.5V,40mA
帶 LED 驅(qū)動器:
帶監(jiān)控器:
帶序列發(fā)生器:
電源電壓: 5 V ~ 19 V
工作溫度: -40°C ~ 150°C
安裝類型: 表面貼裝
封裝/外殼: 16-SOIC(0.295",7.50mm 寬)裸露焊盤
供應(yīng)商設(shè)備封裝: 16-SOIC W
包裝: 標(biāo)準(zhǔn)包裝
其它名稱: NCV8881PWR2GOSDKR
NCV8881
http://onsemi.com
3
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Min/Max Voltage on WDI
0.3 to 7
V
Min/Max Voltage on RDLY
0.3 to 7
V
Min/Max Voltage on RESB
0.3 to 7
V
Min/Max Voltage on EN
0.3 to 10
V
Max EN Current
10
mA
Min EN Current (with zero VIN voltage)
10
mA
Min/Max Voltage on SYNC
0.3 to 7
V
Min/Max Voltage on ROSC
0.3 to 7
V
Min/Max Voltage COMP
0.3 to 7
V
Min/Max Voltage FB
0.3 to 7
V
Min Voltage SW
 DC
 20 ns
0.7
3
V
Max Voltage VIN to SW
40
V
Max Voltage VIN
40
V
Min/Max Voltage BST
0.3 to 30
V
Min/Max Voltage BST to SW
0.3 to 15
V
Min/Max Voltage on 8P5
0.3 to 9.5
V
Max 8P5 Current
70
mA
Min/Max Voltage on LDOMON
0.3 to 7
V
Min/Max Voltage on 5P0
0.3 to 7
V
Min/Max Voltage IGNBUF
0.3 to 7
V
Storage Temperature range
55 to +150
Operating Junction Temperature Range
T
J
40 to + 150
ESD withstand Voltage Human Body Model
Machine Model
Charged Device Model
V
ESD
2.0
200
>1.0
kV
V
kV
Moisture Sensitivity
MSL
Level 1
Peak Reflow Soldering Temperature
260
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
THERMAL CHARACTERISTICS
Parameter
Board/Mounting Conditions Typical Value
Unit
Minimum Pad (Note 1)
1 sq. inch (Note 2)
Junctiontocase top (Y
JT
, q
JT
)
30
16
癈/W
Junctiontopin 1(Y
JL1
, q
JL1
)
70
65
癈/W
Junctiontoboard (Y
JB
, q
JB
) (Note 3)
15
17
癈/W
Junctiontoambient (R
qJA
, q
JA
)
150
55
癈/W
Specific Notes on Thermal Characterization Conditions:
NOTE: All boards are 0.062 thick FR4, 3 square, with varying amounts of copper heat spreader, in still air (free convection) conditions.
Numerical values are derived from an axisymmetric finiteelement model where active die area, total die area, flag area, pad area,
and board area are equated to the actual corresponding areas.
1. 1 oz. copper, 17.2 mm
2
 spreader area (minimum exposed pad, not including traces which are assumed).
2. 1 oz. copper, 645 mm
2
 (1 in
2
) spreader area (includes exposed pad).
3. Board is defined as center of exposed pad soldered to board; this is the recommended number to be used for thermal calculations, as it
best represents the primary heat flow path and is least sensitive to board and ambient properties.
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