參數(shù)資料
型號: MTP1N100E
廠商: MOTOROLA INC
元件分類: JFETs
英文描述: TMOS POWER FET 1.0 AMPERES 1000 VOLTS RDS(on) = 9.0 OHM
中文描述: 1 A, 1000 V, 9 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-220AB
文件頁數(shù): 2/8頁
文件大?。?/td> 203K
代理商: MTP1N100E
2
Motorola TMOS Power MOSFET Transistor Device Data
ELECTRICAL CHARACTERISTICS
(TJ = 25
°
C unless otherwise noted)
Characteristic
Symbol
Min
Typ
Max
Unit
OFF CHARACTERISTICS
Drain–Source Breakdown Voltage
(VGS = 0 Vdc, ID = 250
μ
Adc)
Temperature Coefficient (Positive)
V(BR)DSS
1000
1.251
Vdc
mV/
°
C
Zero Gate Voltage Drain Current
(VDS = 1000 Vdc, VGS = 0 Vdc)
(VDS = 1000 Vdc, VGS = 0 Vdc, TJ = 125
°
C)
Gate–Body Leakage Current (VGS =
±
20 Vdc, VDS = 0)
IDSS
10
100
μ
Adc
IGSS
100
nAdc
ON CHARACTERISTICS (1)
Gate Threshold Voltage
(VDS = VGS, ID = 250
μ
Adc)
Temperature Coefficient (Negative)
VGS(th)
2.0
3.0
6.0
4.0
Vdc
mV/
°
C
Static Drain–Source On–Resistance (VGS = 10 Vdc, ID = 0.5 Adc)
Drain–Source On–Voltage (VGS = 10 Vdc)
(ID = 1.0 Adc)
(ID = 0.5 Adc, TJ = 125
°
C)
RDS(on)
VDS(on)
6.7
9.0
Ohm
4.86
9.0
9.9
Vdc
Forward Transconductance (VDS = 15 Vdc, ID = 0.5 Adc)
gFS
0.9
1.32
mhos
DYNAMIC CHARACTERISTICS
Input Capacitance
f = 1.0 MHz)
Ciss
Coss
Crss
587
810
pF
Output Capacitance
(VDS = 25 Vdc, VGS = 0 Vdc,
59.6
120
Reverse Transfer Capacitance
12.2
25
SWITCHING CHARACTERISTICS (2)
Turn–On Delay Time
RG = 9.1
)
td(on)
tr
td(off)
tf
9.0
20
ns
Rise Time
(VDD = 500 Vdc, ID = 1.0 Adc,
VGS = 10 Vdc,
12
25
Turn–Off Delay Time
28
55
Fall Time
34
70
Gate Charge
(See Figure 8)
VGS = 10 Vdc)
QT
Q1
Q2
Q3
14.6
21
nC
(VDS = 400 Vdc, ID = 1.0 Adc,
2.8
6.8
5.2
SOURCE–DRAIN DIODE CHARACTERISTICS
Forward On–Voltage (1)
(IS = 1.0 Adc, VGS = 0 Vdc)
(IS = 1.0 Adc, VGS = 0 Vdc, TJ = 125
°
C)
VSD
0.764
0.62
1.0
Vdc
Reverse Recovery Time
(See Figure 14)
dIS/dt = 100 A/
μ
s)
trr
655
ns
(IS = 1.0 Adc, VGS = 0 Vdc,
ta
tb
42
613
Reverse Recovery Stored Charge
QRR
0.957
μ
C
INTERNAL PACKAGE INDUCTANCE
Internal Drain Inductance
(Measured from contact screw on tab to center of die)
(Measured from the drain lead 0.25
from package to center of die)
LD
3.5
4.5
nH
Internal Source Inductance
(Measured from the source lead 0.25
from package to source bond pad)
LS
7.5
nH
(1) Pulse Test: Pulse Width
300
μ
s, Duty Cycle
2%.
(2) Switching characteristics are independent of operating junction temperature.
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