參數(shù)資料
型號: MT58L32L32P
廠商: Micron Technology, Inc.
英文描述: 32K x 32, 3.3V I/O, Pipelined, SCD SyncBurst SRAM(1Mb,3.3V輸入/輸出,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
中文描述: 32K的× 32,3.3V的I / O的流水線,SCD的SyncBurst的SRAM(1兆,3.3V的輸入/輸出,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
文件頁數(shù): 11/17頁
文件大小: 329K
代理商: MT58L32L32P
1Mb: 64K x 18, 32K x 32/36 3.3V I/O, Pipelined, SCD SyncBurst SRAM
MT58L64L18P.p65 – Rev. 9/99
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1999, Micron Technology, Inc.
11
1Mb: 64K x 18, 32K x 32/36
3.3V I/O, PIPELINED, SCD SYNCBURST SRAM
NOTE:
1. Test conditions as specified with the output loading shown in Figure 1 unless otherwise noted.
2. Measured as HIGH above V
IH
and LOW below V
IL
.
3. This parameter is measured with the output loading shown in Figure 2.
4. This parameter is sampled.
5. Transition is measured ±500mV from steady state voltage.
6. Refer to Technical Note TN-58-09, “ Synchronous SRAM Bus Contention Design Considerations,” for a more thorough
discussion on these parameters.
7. OE# is a “ Don’t Care” when a byte write enable is sampled LOW.
8. A WRITE cycle is defined by at least one byte write enable LOW and ADSP# HIGH for the required setup and hold
times. A READ cycle is defined by all byte write enables HIGH and ADSC# or ADV# LOW or ADSP# LOW for the
required setup and hold times.
9. This is a synchronous device. All addresses must meet the specified setup and hold times for all rising edges of CLK
when either ADSP# or ADSC# is LOW and chip enabled. All other synchronous inputs must meet the setup and hold
times with stable logic levels for all rising edges of clock (CLK) when the chip is enabled. Chip enable must be valid at
each rising edge of CLK when either ADSP# or ADSC# is LOW to remain enabled.
ELECTRICAL CHARACTERISTICS AND RECOMMENDED AC OPERATING CONDITIONS
(Note 1) (0oC
T
A
+70oC; V
DD
, V
DD
Q = +3.3V +0.3V/-0.165V)
-6
-7.5
-10
DESCRIPTION
Clock
Clock cycle time
Clock frequency
Clock HIGH time
Clock LOW time
Output Times
Clock to output valid
Clock to output invalid
Clock to output in Low-Z
Clock to output in High-Z
OE# to output valid
OE# to output in Low-Z
OE# to output in High-Z
Setup Times
Address
Address status (ADSC#, ADSP#)
Address advance (ADV#)
Write signals
(BWa#-BWd#, BWE#, GW#)
Data-in
Chip enables (CE#, CE2#, CE2)
Hold Times
Address
Address status (ADSC#, ADSP#)
Address advance (ADV#)
Write signals
(BWa#-BWd#, BWE#, GW#)
Data-in
Chip enables (CE#, CE2#, CE2)
SYMBOL
MIN
MAX
MIN
MAX
MIN
MAX
UNITS
NOTES
t
KC
f
KF
t
KH
t
KL
6.0
7.5
10
ns
166
133
100
MHz
ns
ns
1.7
1.7
1.9
1.9
3.2
3.2
2
2
t
KQ
t
KQX
t
KQLZ
t
KQHZ
t
OEQ
t
OELZ
t
OEHZ
3.5
4.2
5.0
ns
ns
ns
ns
ns
ns
ns
1.5
1.5
1.5
1.5
1.5
1.5
3
3, 4, 5, 6
3, 4, 5, 6
7
3, 4, 5, 6
3, 4, 5, 6
3.5
3.5
4.2
4.2
5.0
5.0
0
0
0
3.5
4.2
4.5
t
AS
t
ADSS
t
AAS
t
WS
1.7
1.7
1.7
1.7
2.0
2.0
2.0
2.0
2.2
2.2
2.2
2.2
ns
ns
ns
ns
8, 9
8, 9
8, 9
8, 9
t
DS
t
CES
1.7
1.7
2.0
2.0
2.2
2.2
ns
ns
8, 9
8, 9
t
AH
t
ADSH
t
AAH
t
WH
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
ns
ns
8, 9
8, 9
8, 9
8, 9
t
DH
t
CEH
0.5
0.5
0.5
0.5
0.5
0.5
ns
ns
8, 9
8, 9
相關(guān)PDF資料
PDF描述
MT58L32L36P 32K x 36, 3.3V I/O, Pipelined, SCD SyncBurst SRAM(1Mb,3.3V輸入/輸出,流水線式,單循環(huán)取消選擇,同步脈沖靜態(tài)存儲器)
MT6V16M16 512K x 16 x 32 banks RDRAM(512K x 16 x 32組 同步動態(tài)RAM)
MT6V16M18 512K x 18 x 32 banks RDRAM(512K x 18 x 32組 同步動態(tài)RAM)
MT9LD272AG 2Meg x 72 Nonbuffered DRAM DIMMs(2M x 72無緩沖動態(tài)RAM雙列直插存儲器模塊)
MT9LD272 2Meg x 72 Buffered DRAM DIMMs(2M x 72緩沖動態(tài)RAM模塊(雙列直插存儲器模塊))
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MT58L32L32PT-10 制造商:Cypress Semiconductor 功能描述:32KX32 SRAM PLASTIC TQFP 3.3V 制造商:Rochester Electronics LLC 功能描述:- Bulk
MT58L32L32PT-10 TR 制造商:Cypress Semiconductor 功能描述:32KX32 SRAM PLASTIC TQFP 3.3V
MT58L32L32PT-6 制造商:Cypress Semiconductor 功能描述:32KX32 SRAM PLASTIC TQFP 3.3V 制造商:Rochester Electronics LLC 功能描述:- Bulk
MT58L32L32PT-6TR 制造商:Rochester Electronics LLC 功能描述:- Tape and Reel
MT58L32L36F-10 制造商:Micron Technology Inc 功能描述: