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參數(shù)資料
| 型號： | MT55L64L36P1 |
| 廠商： | Micron Technology, Inc. |
| 英文描述： | 64K x 36, 3.3V I/O, ZBT SRAM( 2Mb,3.3V輸入/輸出，靜態(tài)RAM) |
| 中文描述： | 64K的× 36，3.3V的I / O的ZBT SRAM的（處理器，3.3V的輸入/輸出，靜態(tài)內(nèi)存） |
| 文件頁數(shù)： | 10/23頁 |
| 文件大?。?/td> | 404K |
| 代理商： | MT55L64L36P1 |
10
2Mb: 128K x 18, 64K x 32/36 3.3V I/O, Pipelined ZBT SRAM
MT55L128L18P1_2.p65
–
Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
2Mb: 128K x 18, 64K x 32/36
3.3V I/O, PIPELINED ZBT SRAM
FBGA PIN DESCRIPTIONS (continued)
x18
x32/x36
4C, 4N, 5C,
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
SYMBOL
V
SS
TYPE
Supply Ground:
GND.
DESCRIPTION
4C, 4N, 5C,
5D, 5E 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6C,
6D,
6E,
6F, 6C,
6D,
6E,
6F,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
7M, 8C, 8N
5P, 5R, 7P, 7R 5P, 5R, 7P, 7R
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
7M, 8C, 8N
DNU
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
No Connect: These signals are not internally connected and
may be connected to ground to improve package heat
dissipation.
1A, 1B, 1C,
1D, 1E, 1F,
1G, 1P, 2C,
2J, 2K, 2L,
2M, 2N, 2P,
2R, 3H, 4B,
5A, 5N, 6N,
9A, 9B, 9H,
10C, 10D, 10E,
10F, 10G,
10H, 10N,
11B, 11J,
11K, 11L,
11M, 11N,
11P, 11R
1A, 1B, 1P,
2C, 2N, 2P,
2R, 3H, 5N,
6N, 9A, 9B,
9H, 10C,
10H, 10N,
11A, 11B,
11P, 11R
NC
–
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