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參數(shù)資料
| 型號： | MT55L512V18PF-6 |
| 廠商： | CYPRESS SEMICONDUCTOR CORP |
| 元件分類： | SRAM |
| 英文描述： | 512K X 18 ZBT SRAM, 3.5 ns, PBGA165 |
| 封裝： | 13 X 15 MM, FBGA-165 |
| 文件頁數(shù)： | 3/25頁 |
| 文件大?。?/td> | 304K |
| 代理商： | MT55L512V18PF-6 |
11
8Mb: 512K x 18, 256K x 32/36 Pipelined ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18P_C.p65 – Rev. 2/02
2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
PIPELINED ZBT SRAM
x18
x32/x36
SYMBOL
TYPE
DESCRIPTION
4C, 4N, 5C,
VSS
Supply Ground: GND.
5D, 5E, 5F, 5G, 5D, 5E, 5F, 5G,
5H, 5J, 5K, 5L, 5H, 5J, 5K, 5L,
5M, 6C, 6D,
6E, 6F, 6G, 6H, 6E, 6F, 6G, 6H,
6J, 6K, 6L, 6M, 6J, 6K, 6L, 6M,
7C, 7D, 7E, 7F, 7C, 7D, 7E, 7F,
7G, 7H, 7J, 7K, 7G, 7H, 7J, 7K,
7L, 7M, 8C, 8N 7L, 7M, 8C, 8N
5P, 7P, 5R, 7R 5P, 7P, 5R, 7R
DNU
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
1A, 1B, 1C, 1D,
1A, 1B, 1P,
NC
–
No Connect: These signals are not internally connected and may be
1E, 1F, 1G,
2C, 2N, 2P,
connected to ground to improve package heat dissipation.
1P, 2C, 2J, 2K, 2R, 3H, 5N,
Pin 9B is reserved for address pin expansion; 16MB.
2L, 2M, 2N,
6N, 9B, 9H,
2P, 2R, 3H, 4B, 10C, 10H, 10N,
5A, 5N, 6N,
11A, 11B, 11P
9B, 9H, 10C,
10D, 10E, 10F,
10G, 10H, 10N,
11B, 11J, 11K,
11L, 11M,
11N, 11P
NF
—
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
FBGA PIN DESCRIPTIONS (CONTINUED)
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| MT55L512Y32PF-10 | 制造商:Micron Technology Inc 功能描述: |
| MT55L512Y32PT-10 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
| MT55L512Y32PT-6 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Micron Technology Inc 功能描述: |
| MT55L512Y32PT-7.5 | 制造商:Cypress Semiconductor 功能描述:512KX32 SRAM PLASTIC TQFP 3.3V |
| MT55L512Y36FT10 | 制造商:Micron Technology Inc 功能描述: |
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