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參數(shù)資料
| 型號(hào)： | MT55L256L32FT-12 |
| 元件分類： | SRAM |
| 英文描述： | 256K X 32 ZBT SRAM, 9 ns, PQFP100 |
| 封裝： | PLASTIC, TQFP-100 |
| 文件頁數(shù)： | 3/25頁 |
| 文件大?。?/td> | 300K |
| 代理商： | MT55L256L32FT-12 |
11
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
Micron Technology, Inc., reserves the right to change products or specifications without notice.
MT55L512L18F_C.p65 – Rev. 2/02
2002, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
FBGA PIN DESCRIPTIONS (continued)
x18
x32/x36
SYMBOL
TYPE
DESCRIPTION
1H, 4C, 4N,
VSS
Supply Ground: GND.
5C, 5D, 5E, 5F, 5C, 5D, 5E, 5F,
5G, 5H, 5J,
5K, 5L, 5M,
6C, 6D, 6E, 6F, 6C, 6D, 6E, 6F,
6G, 6H, 6J,
6K, 6L, 6M,
7C, 7D, 7E,
7F, 7G, 7H,
7J, 7K, 7L,
7M, 7N, 8C, 8N 7M, 7N, 8C, 8N
5P, 5R, 7P, 7R 5P, 5R, 7P, 7R
DNU
–
Do Not Use: These signals may either be unconnected or wired to
GND to improve package heat dissipation.
1A, 1B, 1C,
1A, 1B, 1P,
NC
–
No Connect: These signals are not internally connected and may
1D, 1E, 1F,
2C, 2N, 2P,
be connected to ground to improve package heat dissipation.
1G, 1P, 2C,
2R, 3H, 5N,
Pin 9B is reserved for 16MB address expansion.
2J, 2K, 2L,
6N, 9B, 9H,
2M, 2N, 2P,
10C, 10H,
2R, 3H, 4B,
10N, 11A,
9B, 5A, 5N,
11B, 11P
6N, 9H, 10C,
10D, 10E,
10F, 10G,
10H, 10N,
11B, 11J,
11K, 11L,
11M, 11N,
11P
NF
—
No Function: These pins are internally connected to the die and
have the capacitance of an input pin. It is allowable to leave
these pins unconnected or driven by signals.
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PDF描述 |
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| MT58L128L36D1T-5IT | 128K X 36 STANDARD SRAM, 2.8 ns, PQFP100 |
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| MT55L256L32FT-12IT | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| MT55L256L32P | 制造商:MICRON 制造商全稱:Micron Technology 功能描述:8Mb ZBT SRAM |
| MT55L256L32PF-10 | 制造商:Micron Technology Inc 功能描述: |
| MT55L256L32PT10 | 制造商:MICRON 功能描述:* |
| MT55L256L32PT-10 | 制造商:Cypress Semiconductor 功能描述:SRAM Chip Sync Quad 3.3V 8M-Bit 256K x 32 5ns 100-Pin TQFP 制造商:Micron Technology Inc 功能描述: |
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