參數(shù)資料
型號(hào): MT55L256L32F
廠商: Micron Technology, Inc.
英文描述: 8Mb: 256K x 32,F(xiàn)low-Through ZBT SRAM(8Mb流通式同步靜態(tài)存儲(chǔ)器)
中文描述: 8MB的:256K × 32,流量通過ZBT SRAM的(8兆流通式同步靜態(tài)存儲(chǔ)器)
文件頁數(shù): 24/25頁
文件大?。?/td> 380K
代理商: MT55L256L32F
24
8Mb: 512K x 18, 256K x 32/36 Flow-Through ZBT SRAM
MT55L512L18F_2.p65 – Rev. 8/00
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2000, Micron Technology, Inc.
8Mb: 512K x 18, 256K x 32/36
FLOW-THROUGH ZBT SRAM
165-PIN FBGA
NOTE:
1. All dimensions in millimetersMAXor typical where noted.
MIN
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
10.00
14.00
15.00 ±0.10
1.00
(TYP)
1.00
(TYP)
5.00 ±0.05
13.00 ±0.10
PIN A1 ID
PIN A1 ID
BALL A1
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb
SOLDER BALL PAD: .33mm
6.50 ±0.05
7.00 ±0.05
7.50 ±0.05
1.20 MAX
SEATING PLANE
0.85 ±0.075
0.10
A
A
165X 0.45
BALL A11
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
E-mail: prodmktg@micron.com, Internet: http://www.micronsemi.com, Customer Comment Line: 800-932-4992
Micron is a registered trademark of Micron Technology, Inc.
ZBT and Zero Bus Turnaround are trademarks of Integrated Device Technology, Inc.,
and the architecture is supported by Micron Technology, Inc., and Motorola Inc.
相關(guān)PDF資料
PDF描述
MT55L256L36F 8Mb: 256K x 36,F(xiàn)low-Through ZBT SRAM(8Mb流通式同步靜態(tài)存儲(chǔ)器)
MT55L256V32F 8Mb: 256K x 32,F(xiàn)low-Through ZBT SRAM(8Mb流通式同步靜態(tài)存儲(chǔ)器)
MT55L256V36F 8Mb: 256K x 36,F(xiàn)low-Through ZBT SRAM(8Mb流通式同步靜態(tài)存儲(chǔ)器)
MT55L64L32F1 64K x 32,3.3V I/O, ZBT SRAM(2Mb,3.3V輸入/輸出,靜態(tài)RAM)
MT55L64L36F1 64K x 36,3.3V I/O, ZBT SRAM(2Mb,3.3V輸入/輸出,靜態(tài)RAM)
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