參數(shù)資料
型號(hào)： MSC8252TVT1000B
廠商： FREESCALE SEMICONDUCTOR INC
元件分類(lèi)： 數(shù)字信號(hào)處理
英文描述： 0-BIT, OTHER DSP, PBGA783
封裝： 29 X 29 MM, LEAD FREE, PLASTIC, FCBGA-783
文件頁(yè)數(shù)： 17/68頁(yè)
文件大?。?/td> 912K
代理商： MSC8252TVT1000B
MSC8252 Dual-Core Digital Signal Processor Data Sheet, Rev. 5
Electrical Characteristics
Freescale Semiconductor
24
2.2
Recommended Operating Conditions
Table 3 lists recommended operating conditions. Proper device operation outside of these conditions is not guaranteed.
Table 4 describes thermal characteristics of the MSC8252 for the FC-PBGA packages.
Table 3. Recommended Operating Conditions
Rating
Symbol
Min
Nominal
Max
Unit
Core supply voltage
VDD
0.97
1.0
1.05
V
M3 memory supply voltage
VDDM3
0.97
1.0
1.05
V
DDR memory supply voltage
DDR2 mode
DDR3 mode
DDR reference voltage
VDDDDR
MVREF
1.7
1.425
0.49
× VDDDDR
1.8
1.5
0.5
× VDDDDR
1.9
1.575
0.51
× VDDDDR
V
I/O voltage excluding DDR and
RapidIO lines
VDDIO
2.375
2.5
2.625
V
Rapid I/O pad voltage
VDDSXP
0.97
1.0
1.05
V
Rapid I/O core voltage
VDDSXC
0.97
1.0
1.05
V
Operating temperature range:
Standard
Higher
Extended
TJ
TA
TJ
0
–40
—
90
105
—
105
°C
Typical power: 1 GHz at 1.0 V1
P
—
3.54
—
W
Notes:
1.
The typical power values are derived for a device running under the following conditions.
Two cores running at 1 GHz, Core voltage at 1V, 75% utilization (50% control/50% DSP).
A single 64 bit DDR3 running at 800 MHz, 50% utilization (50% reads/50% writes).
M3 Memory 50% utilized, PCI Express controller disabled, TDM enabled 20% loading, Serial RapidIO controller
disabled, 1 RGMII at 1 Gbps 50% loading.
A junction temperature of 60°C.
Table 4. Thermal Characteristics for the MSC8252
Characteristic
Symbol
FC-PBGA
29
× 29 mm2
Unit
Natural
Convection
200 ft/min
(1 m/s) airflow
Junction-to-ambient1, 2
RθJA
18
12
°C/W
Junction-to-ambient, four-layer board1, 2
RθJA
13
9
°C/W
Junction-to-board (bottom)3
RθJB
5
°C/W
Junction-to-case4
RθJC
0.6
°C/W
Notes:
1.
Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance.
2.
Junction-to-ambient thermal resistance determined per JEDEC JESD51-3 and JESDC51-6. Thermal test board meets JEDEC
specification for the specified package.
3.
Junction-to-board thermal resistance determined per JEDEC JESD 51-8. Thermal test board meets JEDEC specification for
the specified package.
4.
Junction-to-case at the top of the package determined using MIL- STD-883 Method 1012.1. The cold plate temperature is used
for the case temperature. Reported value includes the thermal resistance of the interface layer
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