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參數(shù)資料
| 型號： | MR18R326GAG0-CT9 |
| 廠商： | SAMSUNG SEMICONDUCTOR CO. LTD. |
| 英文描述： | (32Mx18) 16pcs RIMM Module based on 576Mb A-die, 32s banks,32K/32ms Ref, 2.5V |
| 中文描述： | （32Mx18）16個RIMM的模塊基于576Mb阿芯片，32秒銀行，32K/32ms參考，為2.5V |
| 文件頁數(shù)： | 11/14頁 |
| 文件大?。?/td> | 259K |
| 代理商： | MR18R326GAG0-CT9 |
Page 10
Version 1.0 Mar. 2004
MR18R326GAG0
Figure 4: RIMM Module PCB Physical Dimensions
Physical Dimensions -1
( For PCB )
The following defines the RIMM module dimensions. All units are in millimeters with inches in brackets[ ], where appropriate.
The dimensions without tolerance specification use the default tolerance of
±
0.127[
±
0.005].
133.35
±
0.127[5.250
±
0.005]
45.00[1.772]
1.00[0.039]
5.68[0.2236]
11.50[0.453]
45.00[1.772]
78.175[3.078]
55.175
±
0.08[2.172
±
0.003]
3
7.468[0.294]
4.50[0.177]
A-1
A-92
DETAIL A
DETAIL B
B-1
0.80
±
0.10
[0.031
±
0.004]
0.15
±
0.10
[0.006
±
0.004]
2.99
±
0.05
[0.12
±
0.002]
DETAIL A
3.00
±
0.10
[0.12
±
0.004]
2.00
±
0.10
[0.079
±
0.004]
DETAIL B
Min.4.88
[0.192]
R 1.00
1.00[0.039]
3.00[0.118]
6.35[0.25]
R 2.00
COMPONENT AREA
(A SIDE)
DIA 2.44
120.65[4.75]
COMPONENT AREA
(B SIDE)
4.00
±
0.15
[0.157
±
0.006]
2
1
Note : The gray area above represents the contact surface of the heat spreader.
+
+
Min.6.35[0.25]
Heat spreader
B-92
8.60[0.339]
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