參數(shù)資料
型號: MPM22CUC450B
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 450 MHz, MICROPROCESSOR, XMA
封裝: MMC-2
文件頁數(shù): 62/64頁
文件大?。?/td> 778K
代理商: MPM22CUC450B
Pentium
III Processor Mobile Module MMC-2
245304-004
Datasheet
1
1.0
Introduction
This document provides the technical specifications for integrating the Intel Pentium III processor
mobile module connector 2 (MMC-2) into the latest notebook systems for today’s notebook
market.
Building around this design gives the system manufacturer these advantages:
Avoids complexities associated with designing high-speed processor core logic boards.
Provides an upgrade path from previous Intel mobile modules using a standard interface.
1.1
References
Refer to the following documents for additional information relating to the Pentium III processor
mobile module.
Mobile Pentium III Processor Datasheet
Intel 440BX AGPSet: 82443BX Host Bridge/Controller Datasheet (Order Number: 290633-001)
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) (Order Number: 290562-001)
Intel 82371MB (PIIX4E/M) Specification Update*
CK97 Clock Synthesizer/Driver Specification (OR-1089)
Intel Pentium III Processor Mobile Module MMC-2 Simulation and Validation Kit Rev. 2.0 (OR-
1781)
Intel Pentium III Processor Mobile Module System Electronics 100-MHz Layout Guidelines Rev.
1.0 (OR-1780)
Mobile Pentium III Processor/440BX AGPset Recommended Design and Debug Practices
(RDDP-A) 100 MHz Rev. 2.0 (SC-2760)
66/100MHz PC SDRAM Unbuffered SO-DIMM Specification Rev 1.0*
Intel Mobile Module Design Guide (AP-590)
Pentium
II Processor Mobile Module MMC-2 Insertion & Extraction User Manual Rev 1.0*
Mobile Pentium II Processor Mobile Module 400-Pin BGA Connector Assembly Development
Guide Rev. 1.0*
Focused Discussion on Intel Mobile Modules Design for Mfg. & Best Methods for MHPG
Customers Rev. 1.0 (OR-1385)
EMI Design Guide (ORMD6-0859)
Intel Mobile Module Newsletters*
Intel Mobile Module Thermal Diode Temperature Sensor Application Note*
Intel MMC-2 Standoff/Receptacle Height Spreadsheet*
AGP Interface Specification Revision 2.0*
*Available now, contact your Intel Field Representative
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