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參數(shù)資料

Pentium

III Processor Mobile Module MMC-2

Datasheet

245304-004

be 2.25-mm gageable thread (2.25-mm minimum to 2.80-mm maximum). The mobile module is

designed to ensure that the thermal resistance between the processor die center and a point directly

above on the TTP surface is

≤ to 0.35° C/W, under the following set of conditions.

RTTP-a = TTP (center point) to ambient = ~2.4° C/W

Ac = Contact area centered between the two TTP attach points = 30 mm x 30 mm.

Figure 21. 82443BX Thermal Transfer Plate (Reference Only)

Figure 22. 82443BX Thermal Transfer Plate Detail

Rivets for PCB Mounting

BX TTP

1.000

± 0.89

3.150

1.050

6.280

3.569

NOTE: All tolerances are

± 0.015 mm unless otherwise noted.

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相關(guān)代理商/技術(shù)參數(shù)	參數(shù)描述
MPM-25S	制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies
MPM-25S-05	制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies
MPM-25S-12	制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies
MPM-25S-15	制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies
MPM-25S-24	制造商:MPD 制造商全稱:MicroPower Direct, LLC 功能描述:Universal Input, 25W Miniature, PC Mount AC/DC Power Supplies

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