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參數(shù)資料
| 型號： | MPM22CUC450B |
| 廠商： | INTEL CORP |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 450 MHz, MICROPROCESSOR, XMA |
| 封裝： | MMC-2 |
| 文件頁數(shù)： | 55/64頁 |
| 文件大小： | 778K |
| 代理商： | MPM22CUC450B |
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Pentium
III Processor Mobile Module MMC-2
245304-004
Datasheet
53
Figure 23. CPU Thermal Transfer Plate (Reference Only)
6.3
Module Physical Support
6.3.1
Module Mounting Requirements
Three mounting holes are available for securing the module to the system base or the system
electronics. See Figure 17 for mounting hole locations. These hole locations and board edge
clearances will remain fixed for all Intel mobile modules. All three mounting holes should be used
to ensure long term mechanical reliability and EMI integrity of the system.
The board edge clearance includes a 0.762-mm (0.030-inches) wide EMI containment ring around
the perimeter of the mobile module. This ring is on each layer of the PCB and is grounded. The
hole patterns also have a plated surrounding ring to use a metal standoff for EMI shielding
purposes. Standoffs should be used to provide support for the installed mobile module. However,
the warpage of the baseboard can vary and should be calculated into the final dimensions of the
standoffs used. All calculations can be made with the Intel
MMC-2 Standoff/Receptacle Height
Spreadsheet. Information on this spreadsheet can be obtained from your local Intel Field
Representative.
Figure 24 shows the standoff support hole details, the board edge clearance, and the dimensions of
the EMI containment ring. No components are placed on the board in the keep-out area.
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