參數資料
型號: MPM21CUB500A
廠商: INTEL CORP
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 500 MHz, MICROPROCESSOR, XMA
封裝: MMC-2
文件頁數: 62/64頁
文件大小: 826K
代理商: MPM21CUB500A
Celeron
Processor Mobile Module MMC-2
at 700 MHz, 650 MHz, 600 MHz, 550 MHz, 500 MHz, and 450 MHz
243357-005
Datasheet
1
1.0
Introduction
This document provides the technical information for integrating the Intel Celeron processor
mobile module connector 2 (MMC-2) into the latest notebook systems for today’s notebook
market.
Building around this design gives the system manufacturer these advantages:
Avoids complexities associated with designing high-speed processor core logic boards
Provides an upgrade path from previous Intel mobile modules using a standard interface
1.1
References
Refer to the following documents for additional information on the Celeron processor mobile
module.
Mobile Celeron Processor in BGA2 and Micro-PGA2 Packages at 700 MHz, 650 MHz, 600
MHz, 500 MHz, 450 MHz, and 400A MHz datasheet (Order Number 245417)
Intel 440BX AGPSet: 82443BX Host Bridge/Controller Datasheet (Order Number: 290633-
001)
82371AB PCI-to-ISA/IDE Xcelerator (PIIX4) (Order Number: 290562-001)
Intel 82371MB (PIIX4E/M) Specification Update
CK97 Clock Synthesizer/Driver Specification (OR-1089)
Intel Mobile Module MMC-2 Simulation and Validation Kit Rev. 4.0 (OR- 2333)
Intel Pentium III Processor Mobile Module System Electronics 100-MHz Layout Guidelines
Rev. 1.0 (OR-1780)
Mobile Pentium III Processor/440BX AGPset Recommended Design and Debug Practices
(RDDP-A) 100 MHz Rev. 2.0 (SC-2760)
66/100 MHz PC SDRAM Unbuffered SO-DIMM Specification Rev 1.0
Intel Mobile Module Design Guide (AP-590)
Pentium II Processor Mobile Module MMC-2 Insertion & Extraction User Manual Rev 1.0
Mobile Pentium II Processor Mobile Module 400-Pin BGA Connector Assembly
Development Guide Rev. 1.0
Focused Discussion on Intel Mobile Modules Design for Mfg. & Best Methods for MHPG
Customers Rev. 1.0 (OR-1385)
EMI design Guide (order number ORMD6-0859)
Intel Mobile Module Newsletters
Intel Mobile Module Thermal Diode Temperature Sensor Application Note
Intel MMC-2 Standoff/Receptacle Height Spreadsheet
AGP Interface Specification Version 2.0
相關PDF資料
PDF描述
MPM21CUB600B 32-BIT, 600 MHz, MICROPROCESSOR, XMA
MPM21CUB450A 32-BIT, 450 MHz, MICROPROCESSOR, XMA
MPM22CGA850B 32-BIT, 850 MHz, MICROPROCESSOR, XMA
MPM22CGC600A 32-BIT, 600 MHz, MICROPROCESSOR, XMA
MPM22CGA800A 32-BIT, 800 MHz, MICROPROCESSOR, XMA
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