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參數(shù)資料
| 型號： | MPE603RRX300LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 |
| 文件頁數(shù)： | 11/28頁 |
| 文件大?。?/td> | 418K |
| 代理商： | MPE603RRX300LX |
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MOTOROLA
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
19
1.7.1.2 Mechanical Dimensions of the CBGA Package
Figure 10 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package.
Figure 10. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package
NOTES:
1.
DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2.
CONTROLLING DIMENSION: MILLIMETER.
0.200
F
T
255X
A
2X
A1 CORNER
P
N
0.200
2X
E
123456789 1 0 1 1 1 2 1 3 1 4 1 5 1 6
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
E
0.300
T
0.150
D
C
H
0.150 T
B
F
K
G
S
T
DIM
MILLIMETERS
INCHES
MIN
MAX
MIN
MAX
A
21.000 BSC
0.827 BSC
B
21.000 BSC
0.827 BSC
C
2.450
3.000
0.097
0.118
D
0.820
0.930
0.032
0.036
G
1.270 BSC
0.050 BSC
H
0.790
0.990
0.031
0.039
K
0.635 BSC
0.025 BSC
N
5.000
16.000
0.197
0.630
P
5.000
16.000
0.197
0.630
F
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sc
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S
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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