參數(shù)資料
型號: MPE603RRX300LX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 300 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁數(shù): 10/28頁
文件大?。?/td> 418K
代理商: MPE603RRX300LX
18
EC603e Microprocessor Hardware Specifications (PID7t), Rev. 2.0
MOTOROLA
1.7 Package Descriptions
The following sections provide the package parameters and the mechanical dimensions for the PID7t. Note
that the PID7t is currently offered only in the ceramic ball grid array (CBGA) package.
1.7.1 CBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the CBGA package.
1.7.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 21 mm x 21 mm, 255-
lead ceramic ball grid array (CBGA).
Package outline
21 mm x 21 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Package height
Minimum: 2.45 mm
Maximum: 3.00 mm
Ball diameter
0.89 mm (35 mil)
Maximum heat sink force
10 lbs
TSIZ[02]
A13, D10, B12
High
Output
TT[04]
B13, A15, B16, C14, C15
High
I/O
WT
D02
Low
Output
VDD 2
F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06, J08, J09, J11,
K07, K10, L06, L08, L09, L11
VOLTDETGND 3
F03
Low
Output
Notes:
1. These are test signals for factory use only and must be pulled up to OVdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. NC (no-connect) in the PID6; internally tied to GND in the PID7v and PID7t CBGA package to indicate to
the power supply that a low-voltage processor is present.
Table 10. Pinout Listing for the 255-Pin CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
F
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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