參數(shù)資料
型號(hào)： MPE603PRX200LX
廠商： FREESCALE SEMICONDUCTOR INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CBGA-255
文件頁(yè)數(shù)： 20/36頁(yè)
文件大?。?/td> 411K
代理商： MPE603PRX200LX
PRELIMINAR
Y
PID7v-EC603e Hardware Specifications
27
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1.8.5 Pull-up Resistor Requirements
The PID7v-EC603e requires high-resistive (weak: 10 K
) pull-up resistors on several control signals of the
bus interface to maintain the control signals in the negated state after they have been actively negated and
released by the PID7v-EC603e or other bus master. These signals are—TS, ABB, DBB, and ARTRY.
In addition, the PID7v-EC603e has three open-drain style outputs that require pull-up resistors (weak or
stronger: 4.7 K
–10 K) if they are used by the system. These signals are—APE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the PID7v-EC603e must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the PID7v-EC603e. It is recommended that these signals be pulled up through weak (10
K
) pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute
inputs are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management data for the PID7v-EC603e. The information found in the rst
sub-sections is based on a typical desktop conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-
bond CQFP package. The heat sink used for this data is a pinn conguration from Thermalloy, part number
2338. The data found in the subsequent sub-sections concerns PID7v-EC603e’s packaged in the 255-lead
21 mm multi-layer ceramic (MLC), ceramic BGA package. Data is shown for two cases, the exposed-die
case (no heat sink) and using the Thermalloy 2338-pin n heat sink.
1.8.6.1 Motorola Wire-Bond CQFP Package
This section provides thermal management data for the PID7v-EC603e; this information is based on a
typical desktop conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-bond CQFP package. The
heat sink used for this data is a pinn conguration from Thermalloy, part number 2338.
1.8.6.1.1 Thermal Characteristics
The thermal characteristics for a wire-bond CQFP package are as follows:
Thermal resistance (junction-to-case) = Rθjc or θjc = 2.2° C/Watt (junction-to-case)
1.8.6.1.2 Thermal Management Example
The following example is based on a typical desktop conguration using a Motorola wire-bond CQFP
package. The heat sink used for this data is a pinn heat sink #2338 attached to the wire-bond CQFP
package with thermal grease.
Figure 14 provides a thermal management example for the Motorola CQFP package.
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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ARCHIVED
BY
FREESCALE
SEMICONDUCT
OR,
INC.
2006
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