參數(shù)資料
型號(hào): MPE603PRX200LX
廠商: FREESCALE SEMICONDUCTOR INC
元件分類: 微控制器/微處理器
英文描述: 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝: 21 X 21 MM, 1.27 MM PITCH, CBGA-255
文件頁數(shù): 16/36頁
文件大小: 411K
代理商: MPE603PRX200LX
PRELIMINAR
Y
PID7v-EC603e Hardware Specifications
23
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1.7.2 CBGA Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola CBGA
packages.
1.7.2.1 Package Parameters
The package parameters are as provided in the following list. The package type is 21 mm x 21 mm, 255-
lead ceramic ball grid array (CBGA).
Package outline
21 mm x 21 mm
Interconnects
255
Pitch
1.27 mm (50 mil)
Package height
Minimum: 2.45 mm
Maximum: 3.00 mm
Ball diameter
0.89 mm (35 mil)
Maximum heat sink force
10 lbs
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Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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ARCHIVED
BY
FREESCALE
SEMICONDUCT
OR,
INC.
2006
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