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參數(shù)資料
| 型號： | MPE603PRX200LX |
| 廠商： | FREESCALE SEMICONDUCTOR INC |
| 元件分類： | 微控制器/微處理器 |
| 英文描述： | 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255 |
| 封裝： | 21 X 21 MM, 1.27 MM PITCH, CBGA-255 |
| 文件頁數(shù)： | 14/36頁 |
| 文件大?。?/td> | 411K |
| 代理商： | MPE603PRX200LX |
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PRELIMINAR
Y
PID7v-EC603e Hardware Specifications
21
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1.7 Package Descriptions
The following sections provide the package parameters and the mechanical dimensions for the PID7v-
EC603e. Note that the PID7v-EC603e is currently offered in two types of CQFP packages—the Motorola
wire-bond CQFP and the ceramic ball grid array (CBGA) package.
1.7.1 Motorola Wire-Bond CQFP Package Description
The following sections provide the package parameters and mechanical dimensions for the Motorola wire-
bond CQFP package.
1.7.1.1 Package Parameters
The package parameters are as provided in the following list. The package type is 32 mm x 32 mm, 240-pin
ceramic quad at pack.
Package outline
32 mm x 32 mm
Interconnects
240
Pitch
0.5 mm (20 mil)
TCK
C11
—
Input
TDI
A11
High
Input
TDO
A12
High
Output
TEA
H13
Low
Input
TLBISYNC
C04
Low
Input
TMS
B11
High
Input
TRST
C10
Low
Input
TS
J13
Low
I/O
TSIZ[0–2]
A13, D10, B12
High
Output
TT[0–4]
B13, A15, B16, C14, C15
High
I/O
WT
D02
Low
Output
VDD2
F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06, J08, J09, J11,
K07, K10, L06, L08, L09, L11
——
VOLTDETGND3
F03
Low
Output
Notes:
1. These are test signals for factory use only and must be pulled up to OVdd for normal machine operation.
2. OVdd inputs supply power to the I/O drivers and Vdd inputs supply power to the processor core.
3. Internally tied to GND to indicate to the power supply that a low-voltage processor is present.
Table 11. Pinout Listing for the 255 CBGA Package (Continued)
Signal Name
Pin Number
Active
I/O
F
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I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
n
c
..
.
ARCHIVED
BY
FREESCALE
SEMICONDUCT
OR,
INC.
2006
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