參數(shù)資料
型號(hào)： MPE603PRX200LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 20/36頁(yè)
文件大?。?/td> 201K
代理商： MPE603PRX200LX
PRELIMINAR
Y
MOTOROLA
EC603e Microprocessor Hardware Specifications (PID7v)
27
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
Figure 14. Motorola CQFP Thermal Management Example
The junction temperature can be calculated from the junction-to-ambient thermal resistance, as follows:
Junction temperature:
Tj = Ta + Rθja * P
or
Tj = Ta + (Rθjc + Rcs + Rsa) * P
Where:
Ta is the ambient temperature in the vicinity of the device
Rθja is the junction-to-ambient thermal resistance
Rθjc is the junction-to-case thermal resistance of the device
Rcs is the case-to-heat sink thermal resistance of the interface material
Rsa is the heat sink-to-ambient thermal resistance
P is the power consumed by the device
In this environment, it can be assumed that all the heat is consumed to the ambient through the heat sink, so
the junction-to-ambient thermal resistance is the sum of the resistances from the junction to the case, from
the case to the heat sink, and from the heat sink to the ambient.
Note that verication of external thermal resistance and case temperature should be performed for each
application. Thermal resistance can vary considerably due to many factors including degree of air
turbulence.
For a power consumption of 2.5 Watts in an ambient temperature of 40
°C at 1 m/sec with the heat sink
measured above, the junction temperature of the device would be as follows:
Tj = Ta + Rθja * P
Tj = 40 °C + (10 °C/Watt * 2.5 Watts) = 65 °C
which is well within the reliability limits of the device.
01
2
3
5
0
5
10
15
20
25
30
35
Motorola Wire-Bond CQFP
With Heat Sink
Forced Convection (m/sec)
J
unction-to-Ambient
Thermal
Resistance
(
°C/watt)
4
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