參數(shù)資料
型號(hào)： MPE603PRX200LX
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 200 MHz, RISC PROCESSOR, CBGA255
封裝： 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
文件頁(yè)數(shù)： 19/36頁(yè)
文件大?。?/td> 201K
代理商： MPE603PRX200LX
PRELIMINAR
Y
26
EC603e Microprocessor Hardware Specifications (PID7v)
MOTOROLA
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
1.8.5 Pull-up Resistor Requirements
The PID7v requires high-resistive (weak: 10 K
) pull-up resistors on several control signals of the bus
interface to maintain the control signals in the negated state after they have been actively negated and
released by the PID7v or other bus master. These signals are—TS, ABB, DBB, and ARTRY.
In addition, the PID7v has three open-drain style outputs that require pull-up resistors (weak or stronger:
4.7 K
–10 K) if they are used by the system. These signals are—APE, DPE, and CKSTP_OUT.
During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master
and may oat in the high-impedance state for relatively long periods of time. Since the PID7v must
continually monitor these signals for snooping, this oat condition may cause excessive power draw by the
input receivers on the PID7v. It is recommended that these signals be pulled up through weak (10 K
) pull-
up resistors or restored in some manner by the system. The snooped address and transfer attribute inputs
are—A[0–31], AP[0–3], TT[0–4], TBST, and GBL.
The data bus input receivers are normally turned off when no read operation is in progress and do not require
pull-up resistors on the data bus.
1.8.6 Thermal Management Information
This section provides thermal management data for the PID7v. The information found in the rst sub-
sections is based on a typical desktop conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-bond
CQFP package. The heat sink used for this data is a pinn conguration from Thermalloy, part number
2338. The data found in the subsequent sub-sections concerns PID7v’s packaged in the 255-lead 21 mm
multi-layer ceramic (MLC), ceramic BGA package. Data is shown for two cases, the exposed-die case (no
heat sink) and using the Thermalloy 2338-pin n heat sink.
1.8.6.1 Motorola Wire-Bond CQFP Package
This section provides thermal management data for the PID7v; this information is based on a typical desktop
conguration using a 240 lead, 32 mm x 32 mm, Motorola wire-bond CQFP package. The heat sink used
for this data is a pinn conguration from Thermalloy, part number 2338.
1.8.6.1.1 Thermal Characteristics
The thermal characteristics for a wire-bond CQFP package are as follows:
Thermal resistance (junction-to-case) = Rθjc or θjc = 2.2° C/Watt (junction-to-case)
1.8.6.1.2 Thermal Management Example
The following example is based on a typical desktop conguration using a Motorola wire-bond CQFP
package. The heat sink used for this data is a pinn heat sink #2338 attached to the wire-bond CQFP
package with thermal grease.
Figure 14 provides a thermal management example for the Motorola CQFP package.
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