參數(shù)資料
型號(hào): MPC8540PXAQFC
廠商: Freescale Semiconductor
文件頁(yè)數(shù): 11/104頁(yè)
文件大小: 0K
描述: MPU POWERQUICC III 783FCPBGA
標(biāo)準(zhǔn)包裝: 36
系列: MPC85xx
處理器類(lèi)型: 32-位 MPC85xx PowerQUICC III
速度: 1.0GHz
電壓: 1.3V
安裝類(lèi)型: 表面貼裝
封裝/外殼: 784-BBGA,F(xiàn)CBGA
供應(yīng)商設(shè)備封裝: 783-FCPBGA(29x29)
包裝: 托盤(pán)
MPC8540 Integrated Processor Hardware Specifications, Rev. 4.1
14
Freescale Semiconductor
Clock Timing
4 Clock Timing
4.1 System Clock Timing
Table 7 provides the system clock (SYSCLK) AC timing specifications for the MPC8540.
4.2 TSEC Gigabit Reference Clock Timing
Table 7 provides the TSEC gigabit reference clock (EC_GTX_CLK125) AC timing specifications for the
MPC8540.
Table 7. SYSCLK AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
SYSCLK frequency
fSYSCLK
——
166
MHz
1
SYSCLK cycle time
tSYSCLK
6.0
ns
SYSCLK rise and fall time
tKH, tKL
0.6
1.0
1.2
ns
2
SYSCLK duty cycle
tKHKL/tSYSCLK
40
60
%
3
SYSCLK jitter
+/- 150
ps
4, 5
Notes:
1.Caution: The CCB to SYSCLK ratio and e500 core to CCB ratio settings must be chosen such that the resulting SYSCLK
frequency, e500 (core) frequency, and CCB frequency do not exceed their respective maximum or minimum operating
settings.
2. Rise and fall times for SYSCLK are measured at 0.6 V and 2.7 V.
3. Timing is guaranteed by design and characterization.
4. This represents the total input jitter—short term and long term—and is guaranteed by design.
5. For spread spectrum clocking, guidelines are +/-1% of the input frequency with a maximum of 60 kHz of modulation
regardless of the input frequency.
Table 8. EC_GTX_CLK125 AC Timing Specifications
Parameter/Condition
Symbol
Min
Typical
Max
Unit
Notes
EC_GTX_CLK125 frequency
fG125
—125
MHz
EC_GTX_CLK125 cycle time
tG125
—8—
ns
EC_GTX_CLK125 rise and fall time
LVDD=2.5
LVDD=3.3
tG125R, tG125F
——
0.75
1
ns
2
EC_GTX_CLK125 duty cycle
GMII, TBI
RGMII, RTBI
tG125H/tG125
45
47
55
53
%1,3
Notes:
1. Timing is guaranteed by design and characterization.
2. Rise and fall times for EC_GTX_CLK125 are measured from 0.5V and 2.0V for LVDD=2.5V, and from 0.6 and 2.7V for
LVDD=3.3V.
3. EC_GTX_CLK125 is used to generate GTX clock for TSEC transmitter with 2% degradation EC_GTX_CLK125 duty cycle
can be loosened from 47/53% as long as PHY device can tolerate the duty cycle generated by GTX_CLK of TSEC.
相關(guān)PDF資料
PDF描述
AMM44DRAI CONN EDGECARD 88POS .156 R/A
XF2J-2624-11A CONN FPC 26POS 0.5MM PITCH SMD
IDT709269L12PFI8 IC SRAM 256KBIT 12NS 100TQFP
ABB100DHBT CONN EDGECARD 200PS R/A .050 SLD
XF2M-5515-1AH CONN FPC 55POS 0.5MM DBL SMD
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8540VT533JB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540VT667LB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540VT667LC 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540VT833LB 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8540VT833LC 功能描述:微處理器 - MPU PQ 3 8540-DRACOM RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類(lèi)型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324