參數(shù)資料
型號: MPC8379E-RDB
廠商: Freescale Semiconductor
文件頁數(shù): 95/117頁
文件大小: 0K
描述: BOARD REFERENCE FOR MPC837
標準包裝: 1
系列: PowerQUICC II™ PRO
類型: MPU
適用于相關產品: MPC8379
所含物品:
MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
Freescale Semiconductor
79
This figure shows the mechanical dimensions and bottom surface nomenclature of the TEPBGA II
package.
Figure 60. Mechanical Dimensions and Bottom Surface Nomenclature of the TEPBGA II
Note:
1 All dimensions are in millimeters.
2 Dimensioning and tolerancing per ASME Y14. 5M-1994.
3 Maximum solder ball diameter measured parallel to Datum A.
4 Datum A, the seating plane, is determined by the spherical crowns of the solder balls.
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