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參數(shù)資料
| 型號： | MPC8379E-RDB |
| 廠商： | Freescale Semiconductor |
| 文件頁數(shù)： | 2/117頁 |
| 文件大?。?/td> | 0K |
| 描述： | BOARD REFERENCE FOR MPC837 |
| 標準包裝： | 1 |
| 系列： | PowerQUICC II™ PRO |
| 類型： | MPU |
| 適用于相關產(chǎn)品： | MPC8379 |
| 所含物品： | 板 |
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MPC8379E PowerQUICC II Pro Processor Hardware Specifications, Rev. 8
10
Freescale Semiconductor
2.2
Power Sequencing
The device requires its power rails to be applied in a specific sequence in order to ensure proper device
operation. During the power ramp up, before the power supplies are stable and if the I/O voltages are
supplied before the core voltage, there may be a period of time that all input and output pins will actively
be driven and cause contention and excessive current. To avoid actively driving the I/O pins and to
eliminate excessive current draw, apply the core voltages (VDD and AVDD) before the I/O voltages and
assert PORESET before the power supplies fully ramp up. VDD and AVDD must reach 90% of their
nominal value before GVDD, LVDD, and OVDD reach 10% of their value, see the following figure. I/O
voltage supplies—GVDD, LVDD, and OVDD—do not have any ordering requirements with respect to one
another.
Figure 3. Power-Up Sequencing Example
Note that the SerDes power supply (L[1,2]_nVDD) should follow the same timing as the core supply
(VDD).
The device does not require the core supply voltage and I/O supply voltages to be powered down in any
particular order.
3
Power Characteristics
The estimated typical power dissipation for the chip device is shown in this table.
Table 5. Power Dissipation 1
Core Frequency
(MHz)
CSB/DDR Frequency
(MHz)
Sleep Power
at Tj =65°C (W)
Typical Application
at Tj =65°C (W)
Typical Application
at Tj =125°C (W)
Max Application
at Tj =125°C (W)
333
333
1.45
1.9
3.2
3.8
167
1.45
1.8
3.0
3.6
400
400
1.45
2.0
3.3
4.0
266
1.45
1.9
3.1
3.8
t
90%
V
Core Voltage (VDD, AVDD)
I/O Voltage (GVDD, LVDD, and OVDD)
0
0.7 V
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