RGMII and RTBI AC Timing
參數(shù)資料
型號(hào)： MPC8313E-RDBB
廠商： Freescale Semiconductor
文件頁數(shù)： 20/99頁
文件大?。?/td> 0K
描述： BOARD CPU 8313E VER 2.1
標(biāo)準(zhǔn)包裝： 1
系列： PowerQUICC II™ PRO
類型： MPU
適用于相關(guān)產(chǎn)品： MPC8313E
所含物品： 板
MPC8313E PowerQUICC II Pro Processor Hardware Specifications, Rev. 4
Freescale Semiconductor
27
8.2.2
RGMII and RTBI AC Timing Specifications
This table presents the RGMII and RTBI AC timing specifications.
Table 30. RGMII and RTBI AC Timing Specifications
At recommended operating conditions with LVDDA/LVDDB of 2.5 V ± 5%.
Parameter/Condition
Symbol1
Min
Typ
Max
Unit
Data to clock output skew (at transmitter)
tSKRGT
–0.5
—
0.5
ns
Data to clock input skew (at receiver) 2
tSKRGT
1.0
—
2.6
ns
Clock cycle duration 3
tRGT
7.2
8.0
8.8
ns
Duty cycle for 1000Base-T 4, 5
tRGTH/tRGT
45
50
55
%
Duty cycle for 10BASE-T and 100BASE-TX 3, 5
tRGTH/tRGT
40
50
60
%
Rise time (20%–80%)
tRGTR
—
0.75
ns
Fall time (20%–80%)
tRGTF
—
0.75
ns
GTX_CLK125 reference clock period
tG12
6
—8.0
—
ns
GTX_CLK125 reference clock duty cycle
tG125H/tG125
47
—
53
%
Note:
1. Note that, in general, the clock reference symbol representation for this section is based on the symbols RGT to represent
RGMII and RTBI timing. For example, the subscript of tRGT represents the RTBI (T) receive (RX) clock. Note also that the
notation for rise (R) and fall (F) times follows the clock symbol that is being represented. For symbols representing skews,
the subscript is skew (SK) followed by the clock that is being skewed (RGT).
2. This implies that PC board design requires clocks to be routed such that an additional trace delay of greater than 1.5 ns is
added to the associated clock signal.
3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively.
4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as
long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed
transitioned between.
5. Duty cycle reference is LVDDA/2 or LVDDB/2.
6. This symbol is used to represent the external GTX_CLK125 and does not follow the original symbol naming convention.
7. The frequency of RX_CLK should not exceed the GTX_CLK125 by more than 300 ppm
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC8313E-RDBB 制造商:Freescale Semiconductor 功能描述:; LEADED PROCESS COMPATIBLE:YES; PEAK RE
MPC8313E-RDBC 功能描述:開發(fā)板和工具包 - 其他處理器 8313E CPU board Ver 2.2 RoHS:否 制造商:Freescale Semiconductor 產(chǎn)品:Development Systems 工具用于評(píng)估:P3041 核心:e500mc 接口類型:I2C, SPI, USB 工作電源電壓:
MPC8313EVRADD 制造商:Freescale Semiconductor 功能描述:MPC83XX RISC 32-BIT 90NM 333MHZ 1V/1.8V/2.5V/3.3V 516-PIN TE - Trays
MPC8313EVRADDB 功能描述:微處理器 - MPU PBGA W/ ENCR RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
MPC8313EVRADDC 功能描述:微處理器 - MPU 8313 REV2.2 W/ENC RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時(shí)鐘頻率:536 MHz 程序存儲(chǔ)器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:FBGA-324
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