參數資料
型號： MPC8245LZU350X
廠商： MOTOROLA INC
元件分類： 微控制器/微處理器
英文描述： 32-BIT, 350 MHz, RISC PROCESSOR, PBGA352
封裝： 35 X 35 MM, 1.65 MM HEIGHT, 1.27 MM PITCH, CAVITY DOWN, TBGA-352
文件頁數： 56/60頁
文件大?。?/td> 620K
代理商： MPC8245LZU350X
6
MPC8245 Integrated Processor Hardware Specications
PRELIMINARY—SUBJECT TO CHANGE WITHOUT NOTICE
General Parameters
1.3 General Parameters
The following list provides a summary of the general parameters of the MPC8245:
Technology
0.25 m CMOS, ve-layer metal
Die size
49.2 mm
2
Transistor count
4.5 million
Logic design
Fully-static
Packages
Surface mount 352 Tape Ball Grid Array (TBGA)
Core power supply:
1.8 V ± 100 mV DC (Only for 266 MHz and 300 MHz parts)
2.0 V ± 100 mV DC
(nominal; see Table 2 for details and recommended operating conditions)
I/O power supply
3.0 to 3.6 V DC
1.4 Electrical and Thermal Characteristics
This section provides the AC and DC electrical specications and thermal characteristics for the
MPC8245.
1.4.1 DC Electrical Characteristics
1.4.1.1 Absolute Maximum Ratings
The tables in this section describe the MPC8245 DC electrical characteristics. Table 1 provides the
absolute maximum ratings.
Table 1. Absolute Maximum Ratings
Characteristic1
Symbol
Range
Unit
Supply Voltage - CPU Core and Peripheral Logic
Vdd
-0.3 to 2.1
V
Supply Voltage - Memory Bus Drivers
GVdd
-0.3 to 3.6
V
Supply Voltage - PCI and Standard I/O Buffers
OVdd
-0.3 to 3.6
V
Supply Voltage - PLLs
AVdd/AVdd2
-0.3 to 2.1
V
Supply Voltage - PCI Reference
LVdd
-0.3 to 5.4
V
Input Voltage2
VIN
-0.3 to 3.6
V
Operational Die-Junction Temperature Range
TJ
0 to 105
°C
Storage Temperature Range
TSTG
-55 to 150
°C
Notes:
1
Functional and tested operating conditions are given in Table 2. Absolute maximum ratings are
stress ratings only, and functional operation at the maximums is not guaranteed. Stresses beyond
those listed may affect device reliability or cause permanent damage to the device.
2
PCI inputs with LVdd = 5V ± 5% V DC may be correspondingly stressed at voltages exceeding
LVdd + 0.5 V DC.
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