參數(shù)資料
型號(hào)： MPC5534MVM80
廠商： Freescale Semiconductor
文件頁數(shù)： 56/60頁
文件大?。?/td> 0K
描述： MCU 1MB FLASH 80MHZ 208MAPBGA
標(biāo)準(zhǔn)包裝： 90
系列： MPC55xx Qorivva
核心處理器： e200z6
芯體尺寸： 32-位
速度： 80MHz
連通性： CAN，EBI/EMI，以太網(wǎng)，SCI，SPI
外圍設(shè)備： DMA，POR，PWM，WDT
輸入/輸出數(shù)： 192
程序存儲(chǔ)器容量： 1MB（1M x 8）
程序存儲(chǔ)器類型： 閃存
RAM 容量： 64K x 8
電壓 - 電源 (Vcc/Vdd)： 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器： A/D 34x12b
振蕩器型： 外部
工作溫度： -40°C ~ 125°C
封裝/外殼： 208-BGA
包裝： 托盤
其它名稱： Q4437099
T0850514
MPC5534 Microcontroller Data Sheet, Rev. 6
Electrical Characteristics
Freescale Semiconductor
6
3.2.1
General Notes for Specifications at Maximum Junction Temperature
An estimation of the device junction temperature, T
J, can be obtained from the equation:
TJ = TA + (RJA PD)
where:
TA = ambient temperature for the package (oC)
RJA = junction to ambient thermal resistance (oC/W)
PD = power dissipation in the package (W)
The thermal resistance values used are based on the JEDEC JESD51 series of standards to provide
consistent values for estimations and comparisons. The difference between the values determined for the
single-layer (1s) board compared to a four-layer board that has two signal layers, a power and a ground
plane (2s2p), demonstrate that the effective thermal resistance is not a constant. The thermal resistance
depends on the:
Construction of the application board (number of planes)
Effective size of the board which cools the component
Quality of the thermal and electrical connections to the planes
Power dissipated by adjacent components
Connect all the ground and power balls to the respective planes with one via per ball. Using fewer vias to
connect the package to the planes reduces the thermal performance. Thinner planes also reduce the thermal
performance. When the clearance between the vias leave the planes virtually disconnected, the thermal
performance is also greatly reduced.
As a general rule, the value obtained on a single-layer board is within the normal range for the tightly
packed printed circuit board. The value obtained on a board with the internal planes is usually within the
normal range if the application board has:
One oz. (35 micron nominal thickness) internal planes
Components are well separated
Overall power dissipation on the board is less than 0.02 W/cm2
The thermal performance of any component depends on the power dissipation of the surrounding
components. In addition, the ambient temperature varies widely within the application. For many natural
convection and especially closed box applications, the board temperature at the perimeter (edge) of the
package is approximately the same as the local air temperature near the device. Specifying the local
ambient conditions explicitly as the board temperature provides a more precise description of the local
ambient conditions that determine the temperature of the device.
6 The thermal characterization parameter indicates the temperature difference between the package top and the junction
temperature per JEDEC JESD51-2.
相關(guān)PDF資料
PDF描述
MPC5553MVR132 MCU 1.5MB FLASH 132MHZ 416-PBGA
MPC555LFMZP40 IC MCU 32BIT 40MHZ 272-BGA
MPC5565MVZ132 MCU 2MB FLASH 132MHZ 324-PBGA
MPC5566MVR132 MCU 3MB FLASH 132MHZ 416-PBGA
MPC561CVR40 IC MPU 32BIT 40MHZ 388-PBGA
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MPC5534MVM80R 制造商:Freescale Semiconductor 功能描述:1MB FLASH,POWERPC Z3 COR - Tape and Reel
MPC5534MVM80R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MVZ40 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MVZ40R2 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
MPC5534MVZ66 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:Microcontroller
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。

采購需求

(若只采購一條型號(hào)，填寫一行即可)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

發(fā)布成功！您可以繼續(xù)發(fā)布采購。也可以進(jìn)入我的后臺(tái)，查看報(bào)價(jià)

*型號(hào) *數(shù)量 廠商 批號(hào) 封裝
添加更多采購

我的聯(lián)系方式

*
*
*