When powering down, V
參數(shù)資料
型號: MPC5534MVM80
廠商: Freescale Semiconductor
文件頁數(shù): 3/60頁
文件大?。?/td> 0K
描述: MCU 1MB FLASH 80MHZ 208MAPBGA
標(biāo)準(zhǔn)包裝: 90
系列: MPC55xx Qorivva
核心處理器: e200z6
芯體尺寸: 32-位
速度: 80MHz
連通性: CAN,EBI/EMI,以太網(wǎng),SCI,SPI
外圍設(shè)備: DMA,POR,PWM,WDT
輸入/輸出數(shù): 192
程序存儲器容量: 1MB(1M x 8)
程序存儲器類型: 閃存
RAM 容量: 64K x 8
電壓 - 電源 (Vcc/Vdd): 1.35 V ~ 1.65 V
數(shù)據(jù)轉(zhuǎn)換器: A/D 34x12b
振蕩器型: 外部
工作溫度: -40°C ~ 125°C
封裝/外殼: 208-BGA
包裝: 托盤
其它名稱: Q4437099
T0850514
Electrical Characteristics
MPC5534 Microcontroller Data Sheet, Rev. 6
Freescale Semiconductor
11
When powering down, VRC33 and VDDSYN have no delta requirement to each other, because the bypass
capacitors internal and external to the device are already charged. When not powering up or down, no delta
between VRC33 and VDDSYN is required for the VRC to operate within specification.
There are no power up/down sequencing requirements to prevent issues such as latch-up, excessive current
spikes, and so on. Therefore, the state of the I/O pins during power up and power down varies depending
on which supplies are powered.
Table 7 gives the pin state for the sequence cases for all pins with pad type pad_fc (fast type).
Table 8 gives the pin state for the sequence cases for all pins with pad type pad_mh (medium type) and
pad_sh (slow type).
The values in Table 7 and Table 8 do not include the effect of the weak-pull devices on the output pins
during power up.
Before exiting the internal POR state, the pins go to a high-impedance state until POR negates. When the
internal POR negates, the functional state of the signal during reset applies and the weak-pull devices
(up or down) are enabled as defined in the device reference manual. If VDD is too low to correctly
propagate the logic signals, the weak-pull devices can pull the signals to VDDE and VDDEH.
To avoid this condition, minimize the ramp time of the VDD supply to a time period less than the time
required to enable the external circuitry connected to the device outputs.
During initial power ramp-up, when vstby is 0.6v or above. a typical current of 1-3mA and maximum of
4mA may be seen until VDD is applied. This current will not reoccur until Vstby is lowered below Vstby
min specification.
Table 7. Pin Status for Fast Pads During the Power Sequence
VDDE
VDD33
VDD
POR
Pin Status for Fast Pad Output Driver
pad_fc (fast)
Low
Asserted
Low
VDDE
Low
Asserted
High
VDDE
Low
VDD
Asserted
High
VDDE
VDD33
Low
Asserted
High impedance (Hi-Z)
VDDE
VDD33
VDD
Asserted
Hi-Z
VDDE
VDD33
VDD
Negated
Functional
Table 8. Pin Status for Medium and Slow Pads During the Power Sequence
VDDEH
VDD
POR
Pin Status for Medium and Slow Pad Output Driver
pad_mh (medium) pad_sh (slow)
Low
Asserted
Low
VDDEH
Low
Asserted
High impedance (Hi-Z)
VDDEH
VDD
Asserted
Hi-Z
VDDEH
VDD
Negated
Functional
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