參數(shù)資料
型號: MPC5200CVR400B
廠商: Freescale Semiconductor
文件頁數(shù): 4/80頁
文件大?。?/td> 0K
描述: IC MPU 32BIT 400MHZ 272-PBGA
特色產(chǎn)品: MPC5200 Microcontroller
標準包裝: 40
系列: MPC52xx
核心處理器: e300
芯體尺寸: 32-位
速度: 400MHz
連通性: CAN,EBI/EMI,以太網(wǎng),I²C,IrDA,J1850,SPI,UART/USART,USB
外圍設備: AC'97,DMA,I²S,POR,PWM,WDT
輸入/輸出數(shù): 56
程序存儲器類型: 外部程序存儲器
RAM 容量: 16K x 8
電壓 - 電源 (Vcc/Vdd): 1.42 V ~ 1.58 V
振蕩器型: 內部
工作溫度: -40°C ~ 85°C
封裝/外殼: 272-BBGA
包裝: 托盤
MPC5200 Data Sheet, Rev. 4
Electrical and Thermal Characteristics
Freescale Semiconductor
12
Historically, the thermal resistance has frequently been expressed as the sum of a junction to case thermal
resistance and a case to ambient thermal resistance:
RθJA =RθJC+RθCA
Eqn. 2
where:
RθJA = junction to ambient thermal resistance (°C/W)
RθJC = junction to case thermal resistance (°C/W)
RθCA = case to ambient thermal resistance (°C/W)
RθJC is device related and cannot be influenced by the user. The user controls the thermal environment to
change the case to ambient thermal resistance, RθCA. For instance, the user can change the air flow around
the device, add a heat sink, change the mounting arrangement on printed circuit board, or change the
thermal dissipation on the printed circuit board surrounding the device. This description is most useful for
ceramic packages with heat sinks where some 90% of the heat flow is through the case to the heat sink to
ambient. For most packages, a better model is required.
A more accurate thermal model can be constructed from the junction to board thermal resistance and the
junction to case thermal resistance1-3. The junction to case covers the situation where a heat sink will be
used or where a substantial amount of heat is dissipated from the top of the package. The junction to board
thermal resistance describes the thermal performance when most of the heat is conducted to the printed
circuit board. This model can be used for either hand estimations or for a computational fluid dynamics
(CFD) thermal model.
To determine the junction temperature of the device in the application after prototypes are available, the
Thermal Characterization Parameter (
ΨJT) can be used to determine the junction temperature with a
measurement of the temperature at the top center of the package case using the following equation:
TJ =TT+(ΨJT × PD)
Eqn. 3
where:
TT = thermocouple temperature on top of package (°C)
Ψ
JT = thermal characterization parameter ( ° C / W )
PD = power dissipation in package (W)
The thermal characterization parameter is measured per JESD51-2 specification using a 40-gauge type T
thermocouple epoxied to the top center of the package case. The thermocouple should be positioned, so
that the thermocouple junction rests on the package. A small amount of epoxy is placed over the
thermocouple junction and over approximately one mm of wire extending from the junction. The
thermocouple wire is placed flat against the package case to avoid measurement errors caused by cooling
effects of the thermocouple wire.
3.2
Oscillator and PLL Electrical Characteristics
The MPC5200 System requires a system-level clock input SYS_XTAL. This clock input may be driven
directly from an external oscillator or with a crystal using the internal oscillator.
相關PDF資料
PDF描述
VI-21B-IY CONVERTER MOD DC/DC 95V 50W
MCIMX31CJMN4D MPU MX31 ARM11 473MAPBGA
V48C5M100BL CONVERTER MOD DC/DC 5V 100W
PD0070WH16138BH1 CAP CER 160PF 13KV 20% CHASSIS
PD0070WH12138BH1 CAP CER 120PF 13KV 20% CHASSIS
相關代理商/技術參數(shù)
參數(shù)描述
MPC5200CVR400B 制造商:Freescale Semiconductor 功能描述:IC, 32BIT PROCESSOR
MPC5200CVR400BR2 制造商:Freescale Semiconductor 功能描述:MPU MPC52XX RISC 32BIT 400MHZ 2.5V/3.3V 272BGA - Tape and Reel
MPC5200CVR466B 制造商:FREESCALE 制造商全稱:Freescale Semiconductor, Inc 功能描述:SDRAM/DDR Memory Controller
MPC5200ID 制造商:MOTOROLA 制造商全稱:Motorola, Inc 功能描述:MPC5200 Hardware Specifications
MPC5200VR400 功能描述:微處理器 - MPU NO-PB COMM 5200 400MHZ RoHS:否 制造商:Atmel 處理器系列:SAMA5D31 核心:ARM Cortex A5 數(shù)據(jù)總線寬度:32 bit 最大時鐘頻率:536 MHz 程序存儲器大小:32 KB 數(shù)據(jù) RAM 大小:128 KB 接口類型:CAN, Ethernet, LIN, SPI,TWI, UART, USB 工作電源電壓:1.8 V to 3.3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:FBGA-324