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參數(shù)資料
| 型號(hào)： | MPC107 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 32-Bit Microprocessor(32位微處理器) |
| 中文描述： | 32位微處理器（32位微處理器） |
| 文件頁數(shù)： | 43/46頁 |
| 文件大?。?/td> | 585K |
| 代理商： | MPC107 |
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MPC107 Hardware Specifications (Rev 0.2)
PRELIMINARYSUBJECT TO CHANGE WITHOUT NOTICE
43
System Design Information
1.7.6.1 Internal Package Conduction Resistance
For the PBGA packaging technology, the intrinsic conduction thermal resistance paths are as follows:
￥
￥
The die junction-to-case thermal resistance
The die junction-to-ball thermal resistance
Figure 26 depicts the primary heat transfer path for a package with an attached heat sink mounted to a
printed-circuit board.
Figure 26. C4 Package with Heat Sink Mounted to a Printed-Circuit Board
For this PBGA package, heat is dissipated from the component via several concurrent paths. Heat is
conducted through the silicon and may be removed to the ambient air by convection and/or radiation. In
addition a second, parallel heat ow path exists by conduction in parallel through the C4 bumps and the
epoxy under-Tll, to the plastic substrate for further convection cooling off the edges. Then from the plastic
substrate, heat is conducted via the leads/balls to the next-level interconnect (printed-circuit board)
whereupon the primary mode of heat transfer is by convection and/or radiation.
External Resistance
External Resistance
Internal Resistance
(Note the internal versus external package resistance)
Radiation
Convection
Radiation
Convection
Heat Sink
Printed-Circuit Board
Thermal Interface Material
Package/Leads
Die Junction
Die/Package
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