
MP4412
2004-07-01
2
Array Configuration
Thermal Characteristics
Characteristics
Symbol
Max
Unit
Thermal resistance from channel to
ambient
(4-device operation, Ta = 25°C)
Σ
R
th (ch-a)
28.4
°C/W
Thermal resistance from channel to
case
(4-device operation, Tc = 25°C)
Σ
R
th (ch-c)
4.46
°C/W
Maximum lead temperature for
soldering purposes
(3.2 mm from case for t = 10 s)
T
L
260
°C
5
4
2
3
1
6
12
11
9
10
8
7