參數(shù)資料
型號(hào)： MCP6S28
廠商： Microchip Technology Inc.
元件分類： FPGA
英文描述： 400000 SYSTEM GATE 2.5 VOLT FPGA - NOT RECOMMENDED for NEW DESIGN
中文描述： 單端，軌至軌I / O，低增益美國(guó)PGA
文件頁(yè)數(shù)： 40/43頁(yè)
文件大小： 880K
代理商： MCP6S28
2002 Microchip Technology Inc.
DS21117A-page 39
MCP6S21/2/6/8
PRODUCT IDENTIFICATION SYSTEM
To order or obtain information, e.g., on pricing or delivery, refer to the factory or the listed sales office
.
Sales and Support
Data Sheets
Products supported by a preliminary Data Sheet may have an errata sheet describing minor operational differences and recom-
mended workarounds. To determine if an errata sheet exists for a particular device, please contact one of the following:
1.
2.
3.
Your local Microchip sales office
The Microchip Corporate Literature Center U.S. FAX: (480) 792-7277
The Microchip Worldwide Site (www.microchip.com)
Please specify which device, revision of silicon and Data Sheet (include Literature #) you are using.
New Customer Notification System
Register on our web site (www.microchip.com/cn) to receive the most current information on our products.
PART NO.
-X
/XX
Package
Temperature
Range
Device
Device:
MCP6S21:
MCP6S21T: One Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S22:
Two Channel PGA
MCP6S22T: Two Channel PGA
(Tape and Reel for SOIC and MSOP)
MCP6S26:
Six Channel PGA
MCP6S26T: Six Channel PGA
(Tape and Reel for SOIC and TSSOP)
MCP6S28:
Eight Channel PGA
MCP6S28T: Eight Channel PGA
(Tape and Reel for SOIC)
One Channel PGA
Temperature Range:
I
= -40°C to +85°C
Package:
MS = Plastic Micro Small Outline (MSOP), 8-lead
P
= Plastic DIP (300 mil Body), 8, 14, and 16-lead
SN = Plastic SOIC, (150 mil Body), 8-lead
SL
= Plastic SOIC (150 mil Body), 14, 16-lead
ST
= Plastic TSSOP (4.4mm Body), 14-lead
Examples:
a)
MCP6S21-I/P: One Channel PGA,
PDIP package.
MCP6S21-I/SN: One Channel PGA,
SOIC package.
MCP6S21-I/MS: One Channel PGA,
MSOP package.
MCP6S22-I/MS: Two Channel PGA,
MSOP package.
MCP6S22T-I/MS: Tape and Reel,
Two Channel PGA, MSOP package.
MCP6S26-I/P: Six Channel PGA,
PDIP package.
MCP6S26-I/SN: Six Channel PGA,
SOIC package.
MCP6S26T-I/ST: Tape and Reel,
Six Channel PGA, TSSOP package.
MCP6S28T-I/SL: Tape and Reel,
Eight Channel PGA, SOIC package.
b)
c)
d)
e)
f)
g)
h)
i)
相關(guān)PDF資料
PDF描述
MCP73827 Single Cell Lithium-Ion Charge Management Controller with Mode Indicator and Charge Current Monitor(單室鋰粒子充電器)
MCP73828(中文) Single Cell Lithium-Ion Charge Management Controller with Charge Complete Indicator and Temperature Monitor(單室鋰粒子充電器)
MCP73831 Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers
MCP73832 Miniature Single-Cell, Fully Integrated Li-Ion, Li-Polymer Charge Management Controllers
MCP73842 FPGA - 200000 SYSTEM GATE 2.5 VOLT - NOT RECOMMENDED for NEW DESIGN
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
MCP6S28-I/P 功能描述:特殊用途放大器 8-Chan. 12 MHz SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
MCP6S28-I/SL 功能描述:特殊用途放大器 8-Chan. 12 MHz SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
MCP6S28-I/SL 制造商:Microchip Technology Inc 功能描述:Operational Amplifier (Op-Amp) IC
MCP6S28T-I/SL 功能描述:特殊用途放大器 8-Chan. 12 MHz SPI RoHS:否 制造商:Texas Instruments 通道數(shù)量:Single 共模抑制比（最小值）: 輸入補(bǔ)償電壓: 工作電源電壓:3 V to 5.5 V 電源電流:5 mA 最大功率耗散: 最大工作溫度:+ 70 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:QFN-20 封裝:Reel
MCP6S2XEV 功能描述:放大器 IC 開(kāi)發(fā)工具 MCP6S2X PGA Eval Brd RoHS:否 制造商:International Rectifier 產(chǎn)品:Demonstration Boards 類型:Power Amplifiers 工具用于評(píng)估:IR4302 工作電源電壓:13 V to 23 V
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