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參數(shù)資料
| 型號： | MCM64E918 |
| 廠商： | Motorola, Inc. |
| 英文描述： | 8M Bit synchronous late write fast static RAM(8M位同步遲寫快速靜態(tài)RAM) |
| 中文描述： | 晚8分位同步靜態(tài)隨機存儲器寫入速度（800萬位同步遲寫快速靜態(tài)內(nèi)存） |
| 文件頁數(shù)： | 23/24頁 |
| 文件大?。?/td> | 503K |
| 代理商： | MCM64E918 |
MCM64E918
MCM64E836
23
MOTOROLA FAST SRAM
PACKAGE DIMENSIONS
FC PACKAGE
153–BUMP FLIPPED CHIP PBGA
CASE 1107A–01
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
153X
BOTTOM VIEW
D
0.2
7
6
5
4
3
2
1
b
0.15
A
E
E2
D2
C
B
e
0.3
A B C
PIN A1
4X
TOP VIEW
16X
M
M
e
8X
E1
D1
3
A
PLANE
SIDE VIEW
A1
A2
A3
A4
0.2 A
0.35 A
0.25 A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M1992.
2. ALL DIMENSIONS IN MILLIMETERS.
3. DIMENSION b IS THE MAXIMUMSOLDER BALL
DIAMETER MEASURED PARALLEL TO DATUM
PLANE A.
4. DATUMA, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE SOLDER
BALLS.
5. D2 AND E2 DEFINE THE AREA OCCUPIED BY
THE DIE. D3 AND E3 ARE THE MINIMUM
CLEARANCE FROMTHE PACKAGE EDGE TO THE
CHIP CAPACITORS.
6. CAPACITORS MAY NOT BE PRESENT ON ALL
DEVICES.
7. CAUTION MUST BE TAKEN NOT TO SHORT
EXPOSED METAL CAPACITOR PADS ON
PACKAGE TOP.
DIM
A
A1
A2
A3
A4
D
D1
D2
E
E1
E2
b
e
MIN
–––
0.50
1.75
0.80
0.92
22.00 BSC
20.32 BSC
11.60
14.00 BSC
7.62 BSC
6.80
0.60
1.27 BSC
MAX
2.77
0.70
2.07
0.92
1.15
MILLIMETERS
11.90
6.11
0.90
A
153X
9
8
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